LED support, LED device and side-in type backlight module

Abstract

The invention provides an LED support, an LED device and a side-in type backlight module. The LED support comprises an insulation support and a positive conductive pin and a negative conductive pin, wherein the positive conductive pin and the negative conductive pin are oppositely embedded into the insulation support; the positive conductive pin and the negative conductive pin comprise a positiveelectrode bonding pad and a negative electrode bonding pad which are exposed from the upper surface of the insulating support respectively; and the positive electrode bonding pad and the negative electrode bonding pad are symmetrically arranged on the insulating support. According to the LED support, the design of the symmetric metal bonding pads is utilized, so that the color difference problem of the LED device can be effectively solved, the light emitting efficiency and stability of the LED device are improved, and large-size chip packaging, high-efficiency flip chip packaging and high-voltage LED packaging are realized.

Description

technical field [0001] The invention relates to the technical field of liquid crystal display, in particular to an LED bracket, an LED device and a side-entry backlight module. Background technique [0002] In recent years, liquid crystal display devices (Liquid Crystal Display, LCD) have become the mainstream of current displays due to their ability to truly reproduce colors in nature. Backlight Module. Generally, the structure of a liquid crystal panel is composed of a color filter (Color Filter, CF) substrate, a thin film transistor (Thin Film Transistor Array Substrate, TFT) array substrate, and a liquid crystal layer arranged between the two substrates, and its working The principle is to control the rotation of the liquid crystal molecules in the liquid crystal layer by applying a driving voltage on the two glass substrates, and refract the light from the backlight module to produce a picture. [0003] Since the liquid crystal panel itself does not emit light, the li...

AI Technical Summary

Problems solved by technology

like figure 2 As shown, the LED chip 50 is placed on the large pad 2, which will cause the intensity of the blue light above the large pad 2 to be greater than that of the small pad 2. After the phosphor is coated, the blue light excites the phosphor to generate yellow light, and the blue light and yellow light Mixed to generate white light, because the blue light intensity of the small pad 3 is small, it cannot be fully mixed with the yellow light to form white light, resulting in a phenomenon of yellowish light output, that is, there will be chromatic aberration in the light output of the LED device

In addition, the LED chip 50 is placed on the large pad 2, the size of the LED chip 50 is limited by the size of the large pad 2, and the small pad 3 is not fully utilized in terms of die bonding, and cannot accommodate a larger size LED chip

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