Adhesive composition

A composition and adhesion technology, applied in the directions of adhesive additives, conductive adhesives, non-polymer adhesive additives, etc., can solve the problems of the decrease of the adhesion between the conductive carbon film and the substrate, and the peeling of the conductive carbon film.

Active Publication Date: 2019-06-25
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, using polyvinylidene fluoride (polyvinylidene fluoride; PVDF) as an adhesive to form a conductive carbon film, although the conductivity of the conductive carbon film can be improved, the adhesion between the conductive carbon film and the substrate is greatly reduced (for example, less than 100gf / 15mm), resulting in the conductive carbon film being easily peeled off from the surface of the substrate

Method used

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Examples

Experimental program
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Effect test

Embodiment 1～7 and comparative example 1～10

[0029] Preparation of Adhesive Compositions - Tests of Different Component Ratio

[0030] According to the weight ratio shown in Table 1, PVDF* (MW28000) with carboxyl group, PVDF* (MW1000000) with carboxyl group, PVDF (MW35000) without carboxyl group, PVDF (MW1000000) without carboxyl group, PVB (MW100000; purchased from Sekisui Chemical), conductive carbon powder (Super P; purchased from Timcal) were added to the solvent N-methylpyrrolidone (NMP), mixed and fully stirred at room temperature (about 25°C) to form an adhesive with a solid content of 5%. combination.

[0031] Film preparation

[0032] The adhesive compositions obtained in Examples 1-7 and Comparative Examples 1-10 were coated on an aluminum foil substrate having a thickness of 20 μm using a wire bar. Next, drying treatment was carried out at 110° C. for 30 minutes to obtain a film with a thickness of about 1 μm.

[0033] Next, the adhesion test between the film and the substrate and the conductivity test of t...

Embodiment 5

[0039] The adhesive composition of Example 5 includes two kinds of PVDF with different weight average molecular weights, wherein the PVDF used both have carboxyl groups, and the adhesive composition also includes PVB. In Example 5, the weight of PVDF* having a carboxyl group accounted for 100% of the weight of the entire PVDF. It can be seen from the results in Table 1 that the adhesive force of the formed film is good.

Embodiment 6

[0040] The adhesive composition of Example 6 includes two PVDFs with different weight average molecular weights, one of the used PVDFs has carboxyl groups, and PVB is also included in the adhesive composition. In Example 6, the weight of PVDF* having carboxyl groups accounted for only 10% by weight of the total PVDF. It can be seen from the results in Table 1 that the adhesive force of the formed film is good.

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Abstract

An adhesive composition is provided. The adhesive composition includes 3-10 parts by weight of polyvinylidene fluoride (PVDF), wherein the polyvinylidene fluoride includes two polyvinylidene fluorideswith different weight average molecular weights ranging from 20000 to 3000000, and at least one of the polyvinylidene fluorides has a carboxyl group; 0.1-0.5 parts by weight of polyvinyl butyral (PVB); and 0.1-3 parts by weight of a conductive powder.

Description

technical field [0001] The invention relates to an adhesive composition, in particular to a conductive adhesive composition and a film formed therefrom. Background technique [0002] Although water-based polymers have been used as adhesives in conductive carbon films, the conductivity of the formed conductive carbon films is not good (for example, less than 0.09S cm -1 ). Therefore, oily polymers such as polyvinylidenefluoride (PVDF) are more commonly used. [0003] However, using polyvinylidene fluoride (polyvinylidene fluoride; PVDF) as an adhesive to form a conductive carbon film, although the conductivity of the conductive carbon film can be improved, the adhesion between the conductive carbon film and the substrate is greatly reduced (for example, less than 100gf / 15mm), resulting in the conductive carbon film being easily peeled off from the substrate surface. [0004] Therefore, there is an urgent need for an adhesive composition, which can form a film that has bot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J127/16C09J129/14C09J11/04
CPCC08K3/08C08K2201/011C09J9/02C08K3/041C08K3/046C08K2201/001C08K3/042C08K2201/005C09J127/16C08L2205/025C08L29/14C08K3/013C08K3/04C08L27/16
Inventor 袁以馨朱文彬吕常兴刘达人
Owner IND TECH RES INST
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