Unlock instant, AI-driven research and patent intelligence for your innovation.

Micro element structure

A micro-component and fixed structure technology, applied in the field of micro-component structure, can solve the problems affecting the yield rate of micro light-emitting diodes, achieve the effect of reducing unclean or residue and improving yield rate

Active Publication Date: 2019-06-25
PLAYNITRIDE
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the size and shape of the contact surface between the fixed structure and the micro-LEDs will affect the yield of the transportation and transfer of the micro-LEDs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Micro element structure
  • Micro element structure
  • Micro element structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0092] Embodiments of the present invention describe the structure of micro components, such as micro light emitting diodes (Micro LEDs) and micro chips, ready for pick-up and transfer to circuit substrates. For example, the receiving substrate may be a display substrate, a light emitting substrate, a substrate with functional elements such as transistors or integrated circuits (ICs), or a substrate with metal redistribution lines, but not limited thereto. While some embodiments of the present invention are specific to describing miniature light emitting diodes comprising p-n diodes, it should be understood that embodiments of the present invention are not limited thereto and certain embodiments are also applicable to other miniature semiconductor components designed in this manner. In order to control the execution of predetermined electronic functions (such as diodes, transistors, integrated circuits) or photonic functions (LEDs, lasers).

[0093] Figure 1A It is a schemati...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a micro element structure. The micro element structure comprises a substrate, at least one micro element and at least one fixing structure, the microelement is disposed on the substrate and has a top surface away from the substrate. The fixing structure is arranged on the substrate and comprises at least one connecting part and at least one fixing part. The connecting part is arranged on at least one edge of the micro element. The fixing part is connected with the connecting part and extends to the substrate. The width of the connection part is gradually increased from the edge of the micro element to the fixing part as seen from the overlook direction.

Description

technical field [0001] The invention relates to a semiconductor structure, in particular to a micro element structure. Background technique [0002] At present, the transfer of micro-LEDs is mainly to transfer the micro-LEDs on the carrier substrate to the receiving substrate by means of electrostatic force or magnetic force. Generally speaking, the micro-LEDs are held by a fixed structure so that the micro-LEDs are easier to pick up from the carrier substrate and transported and transferred to the receiving substrate for placement, and the fixed structure is used to consolidate the micro-LEDs. The quality is affected by other external factors. However, the size and shape of the contact surface between the fixing structure and the micro LEDs will affect the yield rate of the transportation and transfer of the micro LEDs. Therefore, how to make the fixing structure temporarily hold the micro-LEDs, and transport and transfer the micro-LEDs between the carrier substrate and t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/15G09F9/33
CPCH01L21/6835H01L27/156H01L25/0753H01L33/0095H01L33/62H01L33/12
Inventor 吴志凌苏义闵罗玉云
Owner PLAYNITRIDE