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Heat dissipation device for circuit boards

A technology of heat dissipation device and circuit board, which is applied in the direction of cooling/ventilation/heating transformation, chassis/cabinet/drawer parts, etc., can solve the problem of poor heat dissipation effect, etc. clever effect

Inactive Publication Date: 2019-06-25
庄汉杨
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] There are generally a large number of electronic components installed on the circuit board, and the electronic components will generate a large amount of heat when they are working. Therefore, a heat sink is required to dissipate heat from the circuit board. Dust, the accumulation of dust will cause the heat dissipation effect to deteriorate

Method used

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  • Heat dissipation device for circuit boards
  • Heat dissipation device for circuit boards

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Embodiment Construction

[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0015] refer to Figure 1-2 , a heat dissipation device for a circuit board, comprising a mounting shell 1, a mounting frame 2 is fixedly installed on the inner wall of the bottom end of the mounting shell 1, a circuit board body 4 is fixedly mounted on the top of the mounting frame 2, and a circuit board body 4 is fixedly mounted on the top of the mounting frame 2. There is a temperature sensor 5, and two vertical fixed plates 6 are fixedly installed on the top inner wall of the installation shell 1, and a horizontal sliding plate 7 is slidably installed between the two fixed plates 6. On the top inner wall of the installation shell 1, respectively The first threade...

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Abstract

The invention discloses a heat dissipation device for circuit boards, which comprises an installation shell. An installation frame is fixedly installed on the bottom inner wall of the installation shell. A circuit board body is fixedly installed on the top of the installation frame. A temperature sensor is installed on the circuit board body. Two vertically arranged fixing plates are fixedly installed on the top inner wall of the installation shell. A horizontally arranged sliding plate is installed in a sliding manner between the two fixing plates. A first threaded rod and a rotary motor which are vertically arranged are installed on the top inner wall of the installation shell. The first threaded rod and the rotary motor are located between the two fixing plates. The top end of the firstthreaded rod is rotationally connected with the top inner wall of the installation shell. The rotary motor is fixedly connected with the top end of the installation shell. A vertically arranged second threaded rod is fixedly installed on the output shaft of the rotary motor. The heat dissipation device for circuit boards has an ingenious structure, is convenient to use, and has a good dust-prooffunction while guaranteeing good heat dissipation.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a heat dissipation device for a circuit board. Background technique [0002] There are generally a large number of electronic components installed on the circuit board, and the electronic components will generate a large amount of heat when they are working. Therefore, a heat sink is required to dissipate heat from the circuit board. Dust, the accumulation of dust will cause the heat dissipation effect to deteriorate. Contents of the invention [0003] The object of the present invention is to propose a heat dissipation device for a circuit board in order to solve the shortcomings in the prior art. [0004] In order to achieve the above object, the present invention adopts the following technical solutions: [0005] A heat dissipation device for a circuit board, comprising a mounting shell, a mounting frame is fixedly installed on the inner wall of the bottom end of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K5/02
Inventor 庄汉杨
Owner 庄汉杨
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