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Endoscope

A technology of endoscopes and components, applied in the field of endoscopes, can solve the problems of short rigid front ends of endoscopes, and achieve the effect of short rigid front ends and thin diameters

Inactive Publication Date: 2019-07-02
OLYMPUS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is difficult to shorten the rigid distal end of the endoscope

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach >

[0026] Such as figure 1 As shown, the endoscope 90 of this embodiment includes: an insertion portion 9B in which the imaging unit 10 is accommodated in a rigid front end portion 9A; a grip portion 9C provided at the rear of the insertion portion 9B; and a grip portion extending from the grip portion 9C. Universal cord (universalcord) 9D. A signal cable (signal cable) 38 connected to the imaging unit 10 is passed through the universal cable 9D.

[0027] Such as Figure 2 to Figure 5 As shown, the rigid distal end portion 9A of the endoscope 90 is provided with not only the imaging unit 10 but also the water supply and air supply tube 40 as a component. As will be described later, the components provided on the rigid front end portion 9A are not limited to the water supply and air supply pipe 40 .

[0028] It should be noted that in the following description, the drawings based on various embodiments are schematic, and the relationship between the thickness and width of each ...

no. 2 approach >

[0051] The endoscope 90A of the second embodiment is similar to the endoscope 90 and can obtain the same effect, therefore, the same reference numerals are assigned to the same function components and the description thereof will be omitted.

[0052] Such as Figure 7 and Figure 8 As shown, in the endoscope 90A, a metal member made of, for example, copper that is in contact with the rear surface of the first module block 20 is provided on the metal water supply conduit 41 of the water supply and air supply pipe 40 that is a constituent member. 45. That is, the heat generated by the imaging unit 10 can be transmitted to the water supply and air supply pipe 40 via the metal member 45 .

[0053] Since the area of ​​the contact surface of the metal member 45 and the rear surface of the first module block 20 is large, heat can be efficiently transferred. Instead of the metal member 45 made of copper, a high thermal conductivity member made of a high thermal conductivity materia...

no. 3 approach >

[0055] The endoscope 90B of the third embodiment is similar to the endoscope 90 and can obtain the same effect, therefore, the same reference numerals are attached to the same function components and the description thereof will be omitted.

[0056] Such as Figure 9 As shown, in the imaging unit 10B of the endoscope 90B, there are four storage spaces S40A, S50A, S60A, and S70A around the second module block 30B. That is, in the imaging unit 10B, the second module block 30B, which is smaller in plan view than the first module block 20B, is bonded to substantially the center of the rear surface of the first module block 20B. Such as Figure 10 As shown, there are five through-holes H10, H40, H50, H60, H70 in the rigid front end portion 9A.

[0057] The imaging unit 10B is inserted into a rectangular through-hole H10 in a plan view at the center. The water supply and air supply pipe 40 is inserted into a circular through-hole H40 in plan view. The light guides 50 and 60 are ...

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Abstract

An endoscope 90 has an insertion part 9B including a rigid distal-end part 9A, and a gripping part 9C provided to a rear part of the insertion part 9B, a first through hole H10 and a second through hole H40 being present in the rigid distal-end part 9A, an imaging unit 10 which is inserted into the first through hole H10 and which has a layered body of a plurality of optical elements 21-26 and a plurality of semiconductor elements 31-36 including an imaging element 11 comprising a first block 20 including the imaging element 11 and a second block 30 having a surface area smaller than the firstblock 20 in the direction orthogonal to the optical axis, and a portion of a water supply / air supply pipe 40 as a constituent member, the distal-end part of which is inserted in the second through hole H40, being provided in an accommodating space in which a space S20 obtained by extending the first block 20 in the optical axis direction and a space S20 obtained by extending the second block 30 in the direction orthogonal to the optical axis are superposed.

Description

technical field [0001] The present invention relates to an endoscope having an imaging unit having a laminated body of a plurality of semiconductor elements including an imaging element at a rigid distal end portion. Background technique [0002] An endoscope is capable of acquiring images inside a patient, for example, by inserting an insertion portion provided with an imaging unit at its rigid distal end portion into the body of a patient. Japanese Unexamined Patent Publication No. 2005-334509 discloses an imaging unit in which a wiring board on which electronic components such as capacitors, resistors, and ICs constituting a drive circuit are bonded to the back of the imaging element. [0003] An imaging unit having a wiring board on which electronic components are mounted has a long length in the optical axis direction. Therefore, it is difficult to shorten the rigid distal end portion of the endoscope. [0004] In recent years, a semiconductor element formed with a pl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61B1/04
CPCA61B1/00094A61B1/05A61B1/00096G02B23/2423G02B23/2484H04N23/555H04N23/56H04N23/54G02B23/2476A61B1/00091H01L23/12A61B1/12A61B1/044
Inventor 五十岚考俊须贺健介吉田和洋
Owner OLYMPUS CORP