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Method for producing a multilayer conductor plate and conductor plate

A technology of multi-layer conductors and conductor plates, applied in the directions of multi-layer circuit manufacturing, printed circuit manufacturing, printed circuit components, etc., can solve problems such as the consumption of multi-layer conductor plates, and achieve the effect of simple cost and favorable manufacturing.

Pending Publication Date: 2019-07-12
ZKW GRP GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, for cases and applications in which the multilayer conductor plate is to be used substantially only as a heat sink for thermally cooling electronic components arranged thereon, the complex production method according to the aforementioned sufficiently known Manufactured structured multilayer conductor boards are too expensive

Method used

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  • Method for producing a multilayer conductor plate and conductor plate
  • Method for producing a multilayer conductor plate and conductor plate
  • Method for producing a multilayer conductor plate and conductor plate

Examples

Experimental program
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Embodiment Construction

[0093] figure 1 The configuration or structuring of the outer layer 50 of the multilayer conductor plate, which is known per se from the prior art, is shown in steps (A) to (H).

[0094] Step (A) shows the outer layer 50 after cleaning performed previously (that is to say with the surface 70 already cleaned). The outer layer 50 here comprises an insulating film 30 , for example made of a prepreg material based on FR4. Furthermore, the outer layer 50 includes a conductive metal film 20 , which here is made, for example, of copper. The metal film 20 has been laminated on the insulating film 30 .

[0095] Step (B) shows the outer layer 50 after lamination with a photoresist film 80 which is arranged on the outside on the metal film 20 .

[0096] Step (C) shows the exposure of the photoresist film 80 through a mask or exposure template 82 arranged on the outside. The exposure of the photoresist film 80 by means of UV light passing through the openings of the exposure template ...

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PUM

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Abstract

The invention relates to a method for producing a multilayer conductor plate and a conductor plate. The invention provides a manufacturing method of a multilayer conductor plate (1). Insulating layers(30) and conductive metal layers (20) are stacked alternately, so that at least one inner conductive metal layer (20) bears against insulating layers (30) on both sides. The method comprises the following steps: providing an inner layer (40, 44) which comprises at least one conductive metal layer (21) which is unstructured (21) and thus free from etching structures of a photochemical etching process and over its entire layer (23) arranging an upper outer layer (50) on an upper side (41) of the inner layer (40), wherein the outer layer (50) comprises at least one insulating layer (30) and at least one conductive metal layer (20).

Description

technical field [0001] The invention relates to a method for producing a multilayer conductor plate (Leiterplatte, sometimes called a circuit board), which is configured (konfiguriert) such that an insulating film (Isolierschichten, where "film" is sometimes called "layer") The conductive metal foils are stacked alternately, at least one inner conductive metal foil abutting against the insulating foil on both sides. [0002] Furthermore, variants of the conductor plate produced according to the method are described within the scope of the present invention. The multilayer conductor plate is configured such that insulating films and conductive metal films are stacked alternately and laminated to form a conductor plate composite, wherein at least one inner conductive metal film It rests against the insulating film on both sides. Background technique [0003] Various embodiments for multilayer conductor plates are known from the prior art. These multilayer conductor boards a...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/46
CPCH05K1/0203H05K3/4644H05K3/4652H05K1/0206H05K3/429H05K3/4608H05K3/4611H05K2201/09563
Inventor D.佩特施
Owner ZKW GRP GMBH
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