Method for transferring MICRO LED chips out of and into panel from wafer

A chip transfer and chip technology, applied in the manufacturing of instruments, electrical components, semiconductor/solid-state devices, etc., can solve problems such as difficulty in mass production, and achieve the effect of precise matching of binding points, expansion of distance, and no waste of area.

Active Publication Date: 2019-07-16
东莞市中晶半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for transferring MICRO LED chips from wafers to panels, which is used to improve the yield rate of MICRO LED chips in display technology, so that the MICRO LED chips can be precisely positioned with the binding points on the panel Fixed and improved the utilization rate of MICRO LED chips on the wafer during the production process, reduced production costs, and solved a series of problems such as difficulties in mass production

Method used

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  • Method for transferring MICRO LED chips out of and into panel from wafer
  • Method for transferring MICRO LED chips out of and into panel from wafer
  • Method for transferring MICRO LED chips out of and into panel from wafer

Examples

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Effect test

Embodiment 1

[0047] Such as figure 2 As shown, after the entire process of the MICRO LED chip is completed on the wafer, the single MICRO LED chip is not split, but the first unit is divided by multiple quantitative MICRO LED chips in the same area (not necessarily the actual division, you can Virtual), the wafer is divided into multiple chip sets with the same area, the same shape, and an equal number of MICRO LED chips, that is, multiple first units, and are split in units of the first unit, and multiple independent chips are separated from the wafer. the first unit of . In the present invention, splitting is carried out in units of the first unit so that the first unit on the wafer is separated from the wafer, which is defined as the first transfer of the MICRO LED chip, that is, it is transferred from the wafer, but the MICRO LED chip is still on the first unit. After the first unit of the chip set of the MICRO LED chip is separated from the wafer, the second unit is defined on the ...

Embodiment 2

[0049] As in Example 1, the first unit is prepared, the first transfer of the MICRO LED chip is completed, the second unit is defined to start the second transfer of the MICRO LED chip, and the second unit is used as a unit to perform the second first transfer of the MICRO LED chip , one MICRO LED chip on each second unit in the first unit is transferred to the temporary substrate, such as Figure 9 As shown, the MICRO LED chip at position A of each second unit is fixed on the temporary substrate, such as Figure 10 It is shown that the MICRO LED chips in position A of each second unit are peeled off from the first unit by laser. Fix the P electrode of the MICRO LED chip at position A on the temporary substrate; Figure 11 As shown, the MICRO LED chip at position B of each second unit is fixed on the temporary substrate, such as Figure 12 As shown, the MICRO LED chips in position B of each second unit are peeled off from the first unit by laser. The P electrode of the MICR...

Embodiment 3

[0051] The first unit is prepared as in Embodiments 1 and 2, and the first transfer of the MICRO LED chip is completed. The first transfer of the second MICRO LED chip is completed as in Embodiment 2. The required MICRO LED chip has been transferred to the temporary substrate. The MICRO LED chip on the temporary substrate is divided into units according to the chip set, which is defined as the chip set unit X. One MICROLED chip on each unit is transferred to another temporary substrate A. During the same transfer process of the MICRO LED chip, each unit is transferred The rolled-out MICRO LED chips are located at the same position in each unit. Such as Figure 16 As shown, the MICRO LED chip at position A of each chip set unit X is fixed on the temporary substrate X, and the process of the MICRO LED chip at other positions of each chip set unit X is the same as above. The temporary substrate X is matched with the panel at a ratio of 1:1, and all the MICRO LED chips on the tem...

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Abstract

The invention discloses a method for transferring MICRO LED chips out of and into a panel from a wafer. Each MICRO LED chip on the wafer comprises a first unit and second units, and the process of transferring each MICRO LED chip out of and into the panel from the wafer comprises two times of transferring: first-time transferring and second-time transferring. The method for transferring the MICROLED chips is simple, and meanwhile, the utilization ratio of the MICRO LED chips on the wafer in the production process is improved, so that the MICRO LED chips can realize accurate locating and fixing with binding points on the panel.

Description

technical field [0001] The invention relates to MICRO LED chip technology. More specifically, the present invention relates to a method for transferring MICRO LED chips from a wafer into a panel. Background technique [0002] At the CES show in January 2018, Samsung launched a 146-inch giant TV, which is the first TV using Micro LED technology after Samsung's long-term research on Micro LED. Compared with TVs of other technologies, Micro LED TVs have made outstanding progress in brightness, contrast, color saturation, etc. Due to the good characteristics of Micro LEDs, their applications in the field of display technology have been widely promoted, such as smart watches , smartphones, TV monitors, tablet computers, etc. According to industry estimates, the application of Micro LED technology in the large-size display market will account for more than 68% of the entire market by 2025, with an estimated value of US$1.98 billion. This estimate is not groundless. As early as...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/33H01L21/78
CPCG09F9/33H01L21/78
Inventor 朱俊宜庄文荣孙明
Owner 东莞市中晶半导体科技有限公司
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