Heat dissipation device of electronic component

Abstract

The invention relates to the field of heat dissipation, in particular to a heat dissipation device of an electronic component. The heat dissipation device comprises a heat source body, a heat conduction layer, a heat dissipation layer and an elastic heat conduction layer; the upper surface of the heat source body is connected with the heat conduction layer in an attached mode; the heat dissipationlayer is located above the heat conduction layer and is connected with the heat conduction layer in an attached mode; the elastic heat conduction layer is arranged below the heat conduction layer; the elastic heat conduction layer is of a ring type elastic connection piece structure and is connected with the heat source body in an attached mode; the heat source body is fixedly connected with theheat conduction layer through the elastic heat conduction layer; the elastic heat conduction layer comprises a graphene layer and an elastic connecting piece; and the graphene layer is arranged on thesurface of the elastic connecting piece. After the technical scheme is adopted, the heat dissipation device has the beneficial effects that the structure is simple, the fixation and connection are convenient, the heat dissipation area is effectively enlarged, and the heat dissipation speed and the heat dissipation efficiency are improved.

Description

technical field [0001] The invention relates to the field of heat dissipation, in particular to a heat dissipation device for electronic components. Background technique [0002] During the use of electronic components, due to the large amount of heat generated inside the components, if the heat cannot be dissipated, it is easy to cause extreme high temperatures in the system and cause damage to the components themselves. Electronic components generally only work within a certain temperature range To work normally and effectively, the heat energy generated during the working process of these electronic components not only damages their own performance, but also reduces the performance, stability and reliability of the entire system. [0003] The heat dissipation of electronic components is particularly important. Known heat dissipation devices generally include a radiator and a fan. fins. When the heat energy generated by the electronic components is conducted to the heat ...

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Problems solved by technology

[0005] The object of the present invention is to aim at the defects and deficiencies of the prior art, to provide a heat sink for electronic components, which can solve the problem that the current heat sink has a large volume and cannot cope with the demand for thinner and lighter products today, and the heat dissipation problem of the current heat sink Defects with relatively low speed and cooling efficiency

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