A chip packaging machine

Abstract

The invention discloses a chip packaging machine which structurally comprises a control table, an operation screen, a pressing mechanism, a conveying rolling belt and a base. The chip packaging machine has the beneficial effects that the pressing mechanism is studied, separation devices in the mechanism are used for conducting separating packaging on chip packaging bags, synchronous classifying can be conducted on chips while packaging is conducted, and filling of vacuum gas is conducted so that it can be ensured that the chips have the good packaging performance; and the separation devices are used so that grid rubber bars in the longitudinal direction and the transverse direction can be formed, it is ensured that the chips can be classified during packaging, in addition, the best sealing performance can be ensured, vacuum gas leakage in the packaging bags is avoided, meanwhile, due to filling of the vacuum gas, oxidation of the chips can be effectively relieved, and the vacuum gas can also serve as a buffering protection layer so that the chips can be prevented from being fractured the first time the chips are impacted.

Description

technical field [0001] The invention relates to the field of chip packaging, in particular to a chip packaging machine. Background technique [0002] With the upgrading of the industrial structure of the domestic economy, the semiconductor integrated circuit industry at the top of the electronics industry has been placed high hopes and even raised to the height of the national strategy, and the chip industry is the cutting-edge product of the semiconductor industry chain, and chip packaging is undoubtedly the chip manufacturing industry. A problem that needs to be solved urgently, because the existing chip packaging operations generally have poor packaging, and the poor packaging will cause the package to fall when the product is opened, causing the pins to crooked or broken, so that they cannot be repaired and scrapped, and When several chips with the same package and different functions are packaged together, it is difficult to separate them after they are accidentally sca...

AI Technical Summary

Problems solved by technology

[0002] With the upgrading of the industrial structure of the domestic economy, the semiconductor integrated circuit industry at the top of the electronics industry has been placed high hopes and even raised to the height of the national strategy, and the chip industry is the cutting-edge product of the semiconductor industry chain, and chip packaging is undoubtedly the chip manufacturing industry. A problem that needs to be solved urgently, because the existing chip packaging operations generally have poor packaging, and the poor packaging will cause the package to fall when the product is opened, causing the pins to crooked or broken, so that they cannot be repaired and scrapped, and When several chips with the same package and different functions are packaged together, it is difficult to separate them after they are accidentally scattered and mixed together. If they are separated, a lot of manpower and time will be wasted. Most importantly, when the bare chips are scattered After that, it can no longer be used and can only be scrapped, which will inevitably cause unnecessary waste. Based on the above premise, this case developed a chip packaging machine to solve this problem

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