Air conditioner and integrated controller

A controller and integrated technology, applied in heating and ventilation control systems, space heating and ventilation, heating methods, etc., can solve the problems that metal substrates are difficult to meet the heat dissipation of modules, affect the reliable operation of intelligent power modules, and increase heat generation. , to achieve the effect of reducing substrate warpage or substrate delamination, reducing brittleness and increasing reliability

Pending Publication Date: 2019-07-30
GD MIDEA AIR-CONDITIONING EQUIP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problem of the related technology is that the inventors of the present application found that the problem of the related technology is that with the increase of integration, the size of the intelligent power module increase

Method used

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  • Air conditioner and integrated controller
  • Air conditioner and integrated controller
  • Air conditioner and integrated controller

Examples

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Embodiment Construction

[0025] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0026] The air conditioner and the integrated controller according to the embodiment of the present invention will be described below with reference to the accompanying drawings.

[0027] figure 1 is a schematic block diagram of an integrated controller according to an embodiment of the present invention.

[0028] Such as figure 1 As shown, the integrated controller 100 includes: a ceramic substrate 1 , a first metal layer 2 , a second metal layer 3 and a device layer 4 .

[0029] Specifically, such as figure 2 As shown, the...

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Abstract

The invention discloses an air conditioner and an integrated controller. The integrated controller comprises a ceramic substrate, a first metal layer formed on the ceramic substrate, a second metal layer formed under the ceramic substrate and a device layer formed on the first metal layer, at least one gap is formed on the second metal layer, the device layer comprises at least one power module and at least one control device, and therefore the heat dissipation capability of the integrated controller is ensured, reduction of the heat dissipation capability in the using process is avoided, andthe device reliability is improved; and in addition, the brittleness of the ceramic substrate can be reduced, the reliability of the substrate during transportation is increased, and substrate warpingor substrate layering caused by shrinkage factors between the substrate materials in the subsequent injection molding process is reduced.

Description

technical field [0001] The invention relates to the technical field of electronic circuits, in particular to an integrated controller and an air conditioner. Background technique [0002] In related technologies, an intelligent power module of an air conditioner is usually integrated on a metal substrate. However, the problem of the related technology is that the inventors of the present application found that the problem of the related technology is that with the increase of integration, the size of the intelligent power module increases correspondingly, and the heat generation also increases accordingly. It is difficult to meet the heat dissipation of the whole module by using a metal substrate. , affecting the reliable operation of the intelligent power module. Contents of the invention [0003] The present invention aims to solve one of the technical problems in the above-mentioned technologies at least to a certain extent. Therefore, an object of the present inventi...

Claims

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Application Information

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IPC IPC(8): F24F11/88F24F11/77F24F11/86H01L23/15H01L23/367H01L23/373H01L25/065H02M7/00
CPCF24F11/88F24F11/77F24F11/86H01L25/0655H01L23/367H01L23/3736H01L23/15H02M7/003H01L2224/73265H01L2224/48091H01L2924/19107Y02B30/70H01L2924/00014
Inventor 张土明冯宇翔
Owner GD MIDEA AIR-CONDITIONING EQUIP CO LTD
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