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Manufacturing method of same-floor mandarin duck copper circuit board

A production method and circuit board technology, applied in the direction of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of many processes, long time consumption, complexity, etc., to achieve uniform overall board thickness, and meet the needs of production and quality. , the effect of reducing unevenness

Active Publication Date: 2019-07-30
信丰卓思涵电子有限公司
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  • Summary
  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0003] There is no need to use a substrate with different copper thickness requirements. At the same time, there is no way to successfully etch at one time. The production can only be completed through a series of operations, and the quality of production cannot be guaranteed, and the thickness of copper in various places cannot be accurately guaranteed. , and the copper thickness requirements of PCB multilayer boards in the prior art are different, the production is difficult, the process is many and complicated, the time is long and the cost is high

Method used

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Examples

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Embodiment Construction

[0020] First of all, what needs to be explained is that a method for manufacturing a same-layer mandarin duck copper circuit board includes the following steps:

[0021] The first step is typesetting and cutting; in typesetting and cutting, it includes A1, the processing of data, 1.1 divide the thick copper area and thin copper area respectively, and 1.2 respectively compensate the drilling holes in the thick copper area and thin copper area , to achieve drilling compensation for different hole copper requirements, and make drill tape files for thick copper area and thin copper area respectively.

[0022] 1.3 For the line compensation of the thick copper area and the thin copper area, different parameter compensations are performed according to the etching factor, and the corresponding thick copper area line data and thin copper area line data are formed by layered processing.

[0023] 1.4 Unify the solder mask and character layers.

[0024] 1.5 Assembled large boards for the...

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Abstract

The invention discloses a manufacturing method of a same-floor mandarin duck copper circuit board. The manufacturing method comprises the following steps: step one, typesetting cutting; step two, primary circuit; step three, non-flowing adhesive PP and copper foil cutting; step four, press fitting; step five, secondary circuit; and step six, solder resisting, solder resisting and forming. Througha series of operation, the production of the single-faced mandarin duck copper circuit board is realized, the actual problems in the production are solved, simultaneously, the technological process isreduced as much as possible, and high efficiency and high quality of production are realized.

Description

technical field [0001] The invention relates to a production method of a PCB, in particular to a production method of a same-layer mandarin duck copper circuit board. Background technique [0002] With the rapid development of the electronics industry, the technical requirements for printed circuit boards are getting higher and higher, which promotes the continuous development of its design in the direction of high-level and high-density, so that the copper foil thickness of PCB boards is also diversified and complicated. The copper thickness of each layer of the printed circuit board is alternately Hoz and 1oz, 1oz and 2oz, Hoz and 2oz, etc. The copper thickness requirements on both sides are different. In the same layer, a thick copper area and a thin copper area appear, and the difference between the thick copper area and the thin copper area is also increasing. This kind of printed circuit board brings certain difficulties to the existing production method, which is dif...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/18
CPCH05K3/0044H05K3/18H05K2203/1476
Inventor 石燕春王柳婷吴照宇谢汶娉
Owner 信丰卓思涵电子有限公司
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