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Diffuser with corner hcg

A diffuser, corner technology, applied in the direction of coating, gaseous chemical plating, discharge tube, etc.

Pending Publication Date: 2019-07-30
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the size of the substrate increases, it can be challenging to obtain a uniform distribution of the plasma within the processing chamber

Method used

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  • Diffuser with corner hcg
  • Diffuser with corner hcg
  • Diffuser with corner hcg

Examples

Experimental program
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Effect test

Embodiment Construction

[0016] This disclosure will hereinafter refer to a PECVD system configured to process large area substrates, such as the PECVD system available from AKT, a subsidiary of Applied Materials, Inc., Santa Clara, CA. ) for an illustrative description. However, it will be appreciated that the present disclosure may be used in other system configurations, such as those for processing small or circular substrates. The present disclosure may also be used with processing systems made by other manufacturers.

[0017] figure 1 is a schematic cross-sectional view of a processing chamber 100 according to one embodiment. The processing chamber 100 includes a chamber body having a lid 102 and walls 108 . Within at least one wall 108 , there may be one or more slit valve openings 122 to allow insertion and removal of substrates 106 into and out of the processing volume 116 . The processing volume 116 may be bounded by the slit valve opening 122 , the chamber walls 108 , the substrate 106 a...

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PUM

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Abstract

The present disclosure generally relates to a gas distribution plate for ensuring deposition uniformity. The gas distribution plate has multiple concave portions on the downstream side to ensure uniform deposition in corner regions of the processing chamber.

Description

technical field [0001] Embodiments of the invention generally relate to a gas distribution plate for a chemical vapor deposition (CVD) system designed to compensate for deposition non-uniformities. Background technique [0002] Plasma enhanced chemical vapor deposition (PECVD) is a deposition method that has long been used to deposit films onto semiconductor substrates. PECVD has recently been used to deposit films on large area substrates such as solar panel substrates, flat panel display substrates and large area thin film transistor substrates. Market forces continue to drive down the cost of flat panel displays while increasing the size of the substrate. In flat panel display processes, substrate sizes larger than 1 square meter are not uncommon. [0003] A gas distribution plate can be used to ensure that the deposition plasma is evenly distributed throughout the processing chamber. Uniform distribution of the plasma can contribute to film uniformity across the subst...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/455C23C16/50C23C16/458
CPCC23C16/4404C23C16/45565H01J37/3244H01J37/32596C23C16/45559C23C16/50C23C16/4583H01J2237/3323H01J2237/3321
Inventor 赵莱古田学崔寿永朴范洙
Owner APPLIED MATERIALS INC