Silicon wafer cleaning method and cleaning device
A technology for cleaning and cleaning devices for silicon wafers, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of low cleaning efficiency, large water consumption, poor cleaning effect, etc., to reduce water consumption, The effect of reducing the residual amount, improving the cleaning effect and cleaning efficiency
Inactive Publication Date: 2019-08-02
XIAN ESWIN MATERIAL TECH CO LTD +1
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Problems solved by technology
[0003] In view of this, the present invention provides a silicon wafer cleaning method and cleaning device to solve the problems of poor cleaning effect, low cleaning efficiency and large water consumption when cleaning silicon wafers
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[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art fall within the protection scope of the present invention.
[0035] The following first specifically describes the silicon wafer cleaning method according to the embodiment of the present invention with reference to the accompanying drawings.
[0036] The silicon wafer cleaning method according to the embodiment of the present invention includes the following steps: after the silicon wafer is etched with a chemic...
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The invention provides a silicon wafer cleaning method and a cleaning device. The silicon wafer cleaning method comprises the following steps: after liquid medicine is used to etch a silicon wafer, the silicon wafer is immersed in an immersion tank containing ultrapure water for cleaning; after the silicon wafer in the immersion tank is taken out, the silicon wafer is sequentially placed in an Nthwashing tank, an (N-1)th washing tank,..., and a first washing tank for being washed, and after washing in the first washing tank is completed, the silicon wafer is taken out and washing is completed; the first washing tank is provided with washing liquid to be in an overflowing state, the washing liquid overflowing from the first washing tank is supplied to the second washing tank, in a similarfashion, the washing liquid overflowing from the (N-1)th washing tank is supplied to the Nth washing tank, wherein N is an integer larger than 1. Through the above method, the liquid medicine on the surface of the silicon wafer can be cleaned effectively, the residual amount of the liquid medicine or impurities on the surface of the silicon wafer can be reduced, the cleaning effects and the cleaning efficiency are improved, and the water consumption amount when the silicon wafer is cleaned can be reduced.
Description
Technical field [0001] The invention relates to the field of silicon wafer cleaning, in particular to a silicon wafer cleaning method and cleaning device. Background technique [0002] At present, the etching and cleaning method of silicon-based materials (such as monocrystalline silicon, polycrystalline silicon and other silicon blocks) is to pour the silicon blocks into a water tank after the chemical solution is cleaned, and insert a large number of them into the open water tank, through the flow of water in the water tank. For cleaning, a large amount of water is used. Only from the perspective of dilution, the cleaning takes a long time, cannot achieve high efficiency, the cleaning efficiency is low, the residual concentration of the used chemical solution is high, and the cleaning effect cannot meet the requirements. Summary of the invention [0003] In view of this, the present invention provides a silicon wafer cleaning method and a cleaning device to solve the problems of...
Claims
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Login to View More IPC IPC(8): H01L21/02H01L21/67
CPCH01L21/02041H01L21/67023H01L21/6704
Inventor 宫尾秀一
Owner XIAN ESWIN MATERIAL TECH CO LTD