A kind of long-chain alkyl ester modified novolac epoxy curing agent and preparation method thereof

A long-chain alkyl ester, phenolic epoxy technology, applied to the field of in-line phenolic epoxy curing agent and its preparation, can solve the problems of poor compatibility, unfavorable processing and packaging molding, etc., and achieves reduced processing temperature and easy preparation. , The effect of product purification is simple

Active Publication Date: 2021-07-23
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem that the compatibility between the filler and the base material becomes poor, which is not conducive to processing and packaging molding, the present invention provides a long-chain alkyl ester modified novolak epoxy curing agent, and at the same time, provides a long-chain Preparation method of novolak epoxy curing agent modified by alkyl ester

Method used

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  • A kind of long-chain alkyl ester modified novolac epoxy curing agent and preparation method thereof
  • A kind of long-chain alkyl ester modified novolac epoxy curing agent and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] (1) 200 ml of dichloromethane solvent dissolved in 40.525 g of linear tert-butyl resin (500 molecular weight), N 2 0.1 ml of acidic agent triethylamine was added under an atmosphere, stirred in an ice water bath for 10 min to give a phenolic resin-dichloromethane solution.

[0027] (2) The phenolic resin-dichloromethane solution was slowly added dropwise, and the slow drop acceleration was 2 seconds, and the reaction was continued for 3 h, and stirring was stirred at room temperature for 1.5 h, resulting in a long chain alkyl ester Sex phenolic resin-dichloromethane solution;

[0028] (3) Add 10 g of distilled water in a roll-alkyl ester-modified phenolic resin-dichloromethane solution to remove acidic agents, the liquid is obtained, and the dichloromethane is removed under reduced pressure, and the vacuum oven is dried 4H, grind, The linear phenolic epoxy curing agent of the long chain alkyl ester is obtained.

[0029] The seminated alkyl epoxy curing agent of the first em...

Embodiment 2

[0031] (1) 200 ml of dichloromethane solvent dissolved in 40.525 g of linear tert-butyl resin (500 molecular weight), N 2 0.1 ml of acidic agent triethylamine was added under an atmosphere, stirred in an ice water bath for 10 min to give a phenolic resin-dichloromethane solution.

[0032] (2) The phenolic resin-dichloromethane solution was slowly added dropwise, and the slow drop acceleration was 2 seconds, and the reaction was continued for 3.5 h, and the stirring was stirred at room temperature for 2 h, resulting in a long chain alkyl alkyl ester Sex phenolic resin-dichloromethane solution;

[0033] (3) Add 10 g of distilled water in a roll-alkyl ester-modified phenolic resin-dichloromethane solution to remove acidic agents, the liquid is obtained, and the dichloromethane is removed under reduced pressure, and the vacuum oven is dried 4H, grind, The linear phenolic epoxy curing agent of the long chain alkyl ester is obtained.

[0034] The softening temperature of the element-mod...

Embodiment 3

[0036] (1) 200 ml of dichloromethane solvent dissolved in 40.525 g of linear tert-butyl resin (500 molecular weight), N 2 0.1 ml of acidic agent triethylamine was added under an atmosphere, stirred in an ice water bath for 10 min to give a phenolic resin-dichloromethane solution.

[0037] (2) 2.423 g of octorate acid chloride was slowly added dropwise to the phenolic resin-dichloromethane solution, and the slow drop acceleration was 2 seconds, and the reaction was continued for 2.5 h, and stirred at room temperature for 1 h, resulting in a long chain alkyl ester Sex phenolic resin-dichloromethane solution;

[0038] (3) Add 10 g of distilled water in a roll-alkyl ester-modified phenolic resin-dichloromethane solution to remove acidic agents, the liquid is obtained, and the dichloromethane is removed under reduced pressure, and the vacuum oven is dried 4H, grind, The linear phenolic epoxy curing agent of the long chain alkyl ester is obtained.

[0039] The softening temperature of t...

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Abstract

The invention relates to a long-chain alkyl ester modified novolac epoxy curing agent and a preparation method thereof. The modified novolac epoxy curing agent is a substitution reaction of novolak resin and saturated fatty acid chloride under the action of an acid-binding agent; the novolac resin is the common novolac resin and tert-butylphenol-formaldehyde resin (molecular weight: 500-1000). One; the saturated fatty acid chloride is one of dodecanoyl chloride to octadecanoyl chloride; the solvent is methylene chloride; the acid-binding agent is one of triethylamine and pyridine. The preparation method of the modified novolac epoxy curing agent is substitution reaction. The present invention has the advantages that: the long-chain alkyl ester structure of the curing agent can reduce the softening point of the novolak resin, and the apparent viscosity decreases, because the introduction of the long chain will increase the free volume of the system, and the chain segment activity space At the same time, the long-chain alkyl ester structure can play the role of internal plasticization and improve the processing fluidity of epoxy resin.

Description

Technical field [0001] The present invention belongs to the field of polymer synthesis, and more particularly to a linear phenolic epoxy curing agent for long chain alkyl ester modification and a preparation method thereof. Background technique [0002] The type of plastic sector is diverse, mainly including epoxy resin, phenolic resin, cyanate resin, polyimide, etc., wherein the epoxy-plastic seal is simple, low cost, low cost, and reliable performance, and widely applied to the electronic package field. It is the mainstream material in the semiconductor components, electronic package fields. In recent years, as the semiconductor components increase toward high integration, the chip storage capacity increases, the structure complicated direction is developed, and the performance requirements for epoxy-based seals are also greatly improved. In order to meet the needs of development, the epoxy plastic seal is required to have higher thermal conductivity, insulation, and processing...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G8/28C08G59/62
CPCC08G8/28C08G59/62
Inventor 徐卫兵张建英徐鹏周正发马海红任凤梅赵青洋
Owner HEFEI UNIV OF TECH
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