Resin molded article and method for producing resin molded article

Abstract

The object of the present invention is to provide a technology that enables easy molding and suppresses deformation of the insert member when manufacturing a resin molded article using an insert member with low pressure resistance. The method of manufacturing a resin molded article of the present invention includes the steps of: arranging an insert member in a cavity of a mold; injecting molten resin into the cavity; and the molten resin reaching an overflow portion in the cavity. Thereafter, the step of injecting is completed before the molten resin fills the overflow portion; and the step of separating the resin in the overflow portion.

Description

technical field [0001] The present invention relates to a resin molded article and a method for producing the resin molded article. Background technique [0002] Conventionally, catheters have been used to administer medicines, nutrition, etc. to patients, and to perform various treatments. One of the catheters has a plurality of tubes and the branches of the tubes are sealed with resin such as adhesive material. [0003] For example, Patent Document 1 discloses that when manufacturing a balloon catheter, an inner tube and an outer tube into which a metal core is inserted are arranged in a mold, and molten resin is injected to form a branch portion of the tube. [0004] By arranging the insert member in the mold and filling it with resin in this way, the molding method of integrating the insert member with the filled resin is called insert molding, but such insert molding is also used in electronics in the field of components. [0005] For example, Patent Document 2 discl...

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Problems solved by technology

Therefore, it is necessary to insert a metal core into the tube before resin molding, and there is a problem that resin molding cannot be easily performed.

[0012] In addition, when resin-molding a circuit board on which electronic components are mounted as in Patent Document 2, since electronic components such as electrolytic capacitors and resonators cannot withstand the pressure during injection molding, the mounted portion must be exposed to the unfilled area. There is a problem that resin molding cannot be easily performed in the non-cavity space of the resin

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