Method for detecting surface of hot plate

Abstract

The invention discloses a method for detecting the surface of a hot plate, which is used for detecting whether there is foreign matter on the surface of the hot plate to be tested, and the detecting method comprises the following steps: selecting and setting the standard hot plate data in response to the hot plate to be tested, setting a detection range according to the standard hot plate data andthe size of the hot plate to be tested then, obtaining at least one surface image data of the hot plate to be tested in the detection range by utilizing image capturing equipment then, and finally comparing the surface image data with the standard hot plate data, when there is a foreign matter on the surface of the hot plate to be tested, removing the foreign matter on the hot plate to be tested,and reacquiring the surface image data. Thereby, the present invention can prevent the presence of foreign matter on the hot plate, and then the chip rupture caused by the foreign matter adhering tothe hot plate can be prevented in the subsequent process.

Description

technical field [0001] The invention relates to a detection method, in particular to a method for detecting whether there is foreign matter on the surface of the heat plate when producing the heat plate. Background technique [0002] In the electronic industry, the heat plate plays a very important role, for example, it is used in chip bonding or in the operation of bonding wire, so that it will be bonded with the object to be bonded during the wire bonding operation, and the bonded object material for temperature regulation. Therefore, when the hot plate is in production, whether the surface inspection is perfect will affect the pass rate of the object to be bonded, and further affect the pass rate of the entire wire bonding process. [0003] Nowadays, after the hot plate is produced, the process of inspecting whether the hot plate is flawless is through manual inspection. In addition, because of the large number of production, it is not inspected one by one, and most of t...

AI Technical Summary

Problems solved by technology

Small flaws that are invisible to the naked eye will affect the heat conduction efficiency, and if foreign matter sticks to the hot plate, it will easily cause chip cracks in the subsequent chip bonding process, which will further affect the pass rate of the product in the future

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