Impedance reshaping method based on three-level Dual-Buck type circuit
A three-level, circuit technology, applied to electrical components, output power conversion devices, AC power input conversion to DC power output, etc., can solve the problems of changing the internal structure, large power consumption, etc., to solve the problem of large power consumption, Improve the stability margin and solve the effect of changing the internal structure
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[0035] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0036] The impedance remodeling topology based on the three-level Dual-Buck type circuit of the present invention, such as figure 1 As shown, it includes a modular power electronic transformer, a Dual-Buck circuit and a load, the output end of the modular power electronic transformer is connected to the load, and the dual-buck circuit is connected between the modular power electronic transformer and the load.
[0037] Such as figure 2 As shown, the modular power electronic transformer topology includes cascaded H-bridge converter (CHB) and dual active bridge circuit (DAB). In the CHB of the full-bridge module structure, the DC energy storage capacitors of each full-bridge module are Connect the DAB circuit, and connect the DAB output sides of the power modules of the upper and lower bridge arms in parallel to generate a bipolar DC bus;
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