Impedance reshaping method based on three-level Dual-Buck type circuit

A three-level, circuit technology, applied to electrical components, output power conversion devices, AC power input conversion to DC power output, etc., can solve the problems of changing the internal structure, large power consumption, etc., to solve the problem of large power consumption, Improve the stability margin and solve the effect of changing the internal structure

Active Publication Date: 2019-08-16
NORTHEAST DIANLI UNIVERSITY +1
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  • Abstract
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  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide an impedance reshaping topology based on a three-level Dual-Buck circuit, which ensures that the system changes the output impedance value of the source converter according to the output powe

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  • Impedance reshaping method based on three-level Dual-Buck type circuit
  • Impedance reshaping method based on three-level Dual-Buck type circuit
  • Impedance reshaping method based on three-level Dual-Buck type circuit

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Embodiment Construction

[0035] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0036] The impedance remodeling topology based on the three-level Dual-Buck type circuit of the present invention, such as figure 1 As shown, it includes a modular power electronic transformer, a Dual-Buck circuit and a load, the output end of the modular power electronic transformer is connected to the load, and the dual-buck circuit is connected between the modular power electronic transformer and the load.

[0037] Such as figure 2 As shown, the modular power electronic transformer topology includes cascaded H-bridge converter (CHB) and dual active bridge circuit (DAB). In the CHB of the full-bridge module structure, the DC energy storage capacitors of each full-bridge module are Connect the DAB circuit, and connect the DAB output sides of the power modules of the upper and lower bridge arms in parallel to generate a bipolar DC bus;

[...

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Abstract

The invention discloses an impedance reshaping topology based on a three-level Dual-Buck type circuit. The impedance reshaping topology comprises a modular power electronic transformer, a Dual-Buck type circuit and a load, wherein the output end of the modular power electronic transformer is connected to the load; the dual-Buck type circuit is connected between the modular power electronic transformer and the load. The invention also discloses an impedance reshaping method based on the three-level Dual-Buck type circuit. The method achieves impedance reshaping by controlling the inductor current in the Dual-Buck type circuit to change a parallel damping controller, ensures that the system changes the output impedance value of a source converter according to the output power, avoids intersection with load input impedance so as to improve the stability margin of a cascaded system, and solves the large power consumption and an internal structure change caused by the use of a passive device in the prior art.

Description

technical field [0001] The invention belongs to the technical field of impedance reshaping, and in particular relates to an impedance reshaping method based on a three-level Dual-Buck circuit. Background technique [0002] In multi-converter power electronic systems, the stability of the cascaded system has always been the top priority. Middlebrook early proposed to judge the system stability by impedance ratio. In a typical cascaded system structure, the output impedance of the source converter and the load converter The input impedance ratio, equivalent to the gain loop of the system, states that if the source and load converters are each stable, and Z 0 less than Z over the entire frequency range in , then the stability of the cascaded system will be guaranteed, known as the Middlebrook criterion. In order to meet the requirement of impedance judgment ratio, how to change the impedance of the source converter and the load converter has become a hot issue that people pay...

Claims

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Application Information

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IPC IPC(8): H02M7/219
CPCH02M7/219
Inventor 刘闯李岩昊何国庆李洋
Owner NORTHEAST DIANLI UNIVERSITY
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