A kind of smt chip mounter and its chip production process
A placement machine, patch technology, applied in the direction of printed circuit, electrical components, printed circuit manufacturing, etc., can solve the problem of fixed deviation, affecting the rework of the motherboard and production efficiency, to reduce deviation, reduce bump damage, and improve accuracy Effect
Active Publication Date: 2021-11-23
铜陵金基科技有限公司
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Problems solved by technology
[0004] In view of the deficiencies in the prior art, the purpose of the present invention is to provide an SMT placement machine and its placement production process, which solves the problem of easy fixation and deviation when the suction nozzle is placed in the prior art, which affects the rework and production of the main board. benefit
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[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0034] Such as figure 1 As shown, the present invention provides a kind of SMT pick and place machine, comprises machine body 1, holding frame 2, driving module 3, sucker seat 5, and machine body 1 is the box body structure that both ends pass through, and on the machine The bottom of the box where the main body 1 is located is provided with two parallel guide rails 11, and a suction cup group is arranged on the machine body 1 between the guide rails 11. Sliding h...
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The invention discloses an SMT chip mounter and its chip production process, comprising a machine body, the machine body is a box structure with two ends penetrating through it, and a guide rail is arranged at the bottom of the box where the machine body is located, guiding There is a storage frame sliding on the rail. The storage frame includes a storage platform, and an extrusion block is fixed on the opposite side of the edge through a telescopic column. The bottom of the storage platform is symmetrically provided with guide grooves, and the guide grooves are along the The direction of the guide rail slides; the top of the box where the machine body is located is connected to the suction nozzle through a drive module, and the drive module includes a conveyor belt set on the top of the box body of the machine body, and a first hydraulic pressure set at the front end of the conveyor belt. column, and the suction nozzle is connected to the bottom of the first hydraulic column through a fixing plate. The whole operation is convenient, not only the suction nozzle can realize the improvement of the adsorption and transfer effect of the workpiece, but also reduce the bumping of the suction nozzle on the main board, and the setting of the suction cup group can realize the effective fixing of the main board during processing and improve the accuracy of placement.
Description
technical field [0001] The invention belongs to the technical field of SMT placement equipment, and in particular relates to an SMT placement machine and a production process for the placement thereof. Background technique [0002] With the continuous development of science and technology, SMT patch is the main component of SMT production, and it is widely used in the production of electronic original devices. In the production line, the SMT patch machine is configured after the dispenser or screen printing machine. It is a device that accurately places surface mount components on PCB pads by moving the placement head. [0003] The most critical component in the SMT placement machine is the nozzle. The nozzle of the placement machine is not only the key component of the placement machine and the placement of the absorbed originals, but also the background when the camera of the optical vision system takes pictures. It is mainly It uses vacuum adsorption to adsorb components...
Claims
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IPC IPC(8): H05K3/34H05K13/04H05K13/00
CPCH05K3/341H05K13/0061H05K13/046H05K13/0409
Inventor 石爱民谢晨智卞石杰
Owner 铜陵金基科技有限公司