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Novel back plate structure of glass substrate

A glass substrate and backplane technology, applied in glass/slag layered products, optics, instruments, etc., can solve the problems of uncertainty, SiNx insulation layer cracks, affecting the normal use of glass substrates, etc.

Pending Publication Date: 2019-08-20
FUJIAN HUAJIACAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The glass substrate of the liquid crystal panel includes the glass substrate body and the silicon nitride SiNx layer arranged on the lower surface of the glass substrate body. When the glass substrate is cut, due to the external force, the stress inside the SiNx insulating layer on the glass substrate will gradually accumulate. , when it reaches a certain level, it will cause cracks in the SiNx insulating layer. Due to the uncertainty of the position of the cracks, it will affect the normal use of the glass substrate.

Method used

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  • Novel back plate structure of glass substrate

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Embodiment 1

[0044] Please refer to Figure 1-Figure 3 , Embodiment 1 of the present invention is:

[0045] The present invention provides a novel glass substrate backplane structure, including a glass substrate body 1 and a silicon nitride layer 2;

[0046] The upper surface of the silicon nitride layer 2 is arranged on the lower surface of the glass substrate body 1; on the left and right sides of the position corresponding to the cutting position of the glass substrate body 1 on the silicon nitride layer 2, a plurality of A first through hole 4 penetrating the silicon nitride layer 2 and a plurality of second through holes 5 penetrating the silicon nitride layer 2, the plurality of first through holes 4 and the plurality of second through holes 5 are evenly distributed;

[0047] The thickness of the glass substrate body 1 is 0.2-0.5 mm, and the thickness of the silicon nitride layer 2 is 0.2-0.5 mm.

Embodiment 2

[0049] The difference between the second embodiment and the first embodiment is that there are multiple cutting lines 3 on the upper surface of the glass substrate body 1, and multiple cutting lines 3 are provided on the left side of the silicon nitride layer 2 corresponding to each cutting line 3. A uniformly distributed first through hole 4, the silicon nitride layer 2 is provided with a plurality of evenly distributed second through holes 5 on the right side corresponding to each cutting line 3; the first through hole 4 and the second through hole 5 are arranged symmetrically with respect to the corresponding cutting line 3;

[0050] The size and shape of the first through hole 4 and the size and shape of the second through hole 5 are respectively the same, and they are all square through holes, diamond-shaped through holes or circular through holes; the diameter of the circular through holes is 10um ; The length and width of the square through holes are equal, and both are...

Embodiment 3

[0052]The difference between the third embodiment and the first embodiment is that there are multiple cutting lines 3 on the upper surface of the glass substrate body 1, and multiple cutting lines 3 are provided on the left side of the silicon nitride layer 2 corresponding to each cutting line 3. a first through hole 4 distributed in a first array, the first array being an array of multiple rows and two columns;

[0053] A plurality of second through holes 5 distributed in a second array are provided on the right side of the silicon nitride layer 2 corresponding to each cutting line 3, and the second array is an array of multiple rows and two columns;

[0054] The first through hole 4 and the second through hole 5 are arranged symmetrically with respect to the corresponding cutting line 3;

[0055] The size and shape of the first through hole 4 and the size and shape of the second through hole 5 are respectively the same, and they are all square through holes, diamond-shaped t...

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Abstract

The invention provides a novel back plate structure of a glass substrate. The novel back plate structure comprises a glass substrate body and a silicon nitride layer, wherein the upper surface of thesilicon nitride layer is arranged on the lower surface of the glass substrate body; and a plurality of first through holes penetrating through the silicon nitride layer and a plurality of second through holes penetrating through the silicon nitride layer are symmetrically formed at the left and right sides of a position corresponding to a cut position of the silicon nitride layer and the glass substrate body separately and are uniformly distributed. According to the novel back plate structure of the glass substrate, through forming the through holes in the left and right sides of the cut position of the silicon nitride layer, stress generated on the silicon nitride layer during cutting can be effectively released, and the problem that the silicon nitride layer will generate stress during the cutting of the glass substrate, the silicon nitride layer will generate cracks after the stress is accumulated to a certain extent, the normal use of the glass substrate is affected, and meanwhile,the closeness of the glass substrate is lowered can be solved.

Description

technical field [0001] The invention relates to the technical field of glass substrates of liquid crystal panels, in particular to a novel backplane structure of glass substrates. Background technique [0002] The glass substrate of the liquid crystal panel includes the glass substrate body and the silicon nitride SiNx layer arranged on the lower surface of the glass substrate body. When the glass substrate is cut, due to the external force, the stress inside the SiNx insulating layer on the glass substrate will gradually accumulate. , when it reaches a certain level, it will cause cracks in the SiNx insulating layer. Since the position of the cracks is uncertain, it will affect the normal use of the glass substrate. Contents of the invention [0003] The technical problem to be solved by the present invention is: the present invention provides a new glass substrate back plate structure, which can ensure the normal use of the cut glass substrate. [0004] In order to solv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/06B32B3/24G02F1/1333
CPCB32B17/06B32B3/266G02F1/1333G02F1/133302
Inventor 不公告发明人
Owner FUJIAN HUAJIACAI CO LTD