Unlock instant, AI-driven research and patent intelligence for your innovation.

Pipeline cleaning device, pipeline and etching equipment

A technology for cleaning devices and pipes, which is applied to mechanical equipment, cleaning hollow objects, cleaning methods and utensils, etc., can solve problems such as vacuum pump downtime, and achieve the effect of solving abnormal downtime

Active Publication Date: 2019-08-23
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the actual production process, the problem of vacuum pump downtime is often encountered

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Pipeline cleaning device, pipeline and etching equipment
  • Pipeline cleaning device, pipeline and etching equipment
  • Pipeline cleaning device, pipeline and etching equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only the technical solutions of the present invention. Some, but not all, embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0037] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a pipeline cleaning device, a pipeline and etching equipment. The pipeline cleaning device comprises a traction mechanism and a cleaning mechanism, wherein the traction mechanism is used for automatically drawing the cleaning mechanism to enter a target pipeline, move in the target pipeline and exit from the target pipeline; the cleaning mechanism is used for cleaning the inner wall of the target pipeline under the traction of the traction mechanism. The pipeline cleaning device can clean the target pipeline to remove deposits on the inner wall of the target pipeline and guarantee smoothness of the target pipeline, so that the problem that a vacuum pump breaks down abnormally is solved.

Description

technical field [0001] The invention relates to the field of etching, in particular to a pipeline cleaning device, pipeline and etching equipment. Background technique [0002] In the current manufacturing process of integrated circuits, there are two types of thin film etching: dry etching and wet etching. For the etching of general a-Si, SiNx, SiOx, and some metal films, dry etching is mostly used. [0003] Specifically, the etching gas is introduced into the reaction chamber and reacts with the surface of the workpiece to be etched, and the volatile by-products of the reaction are sucked away by the vacuum pump. The use of dry etching will generate a large number of by-products, which need to be discharged through the exhaust pipe, and then go through the factory acid discharge pipe to the factory spray tower for secondary treatment. In the actual production process, the problem of vacuum pump downtime is often encountered. Contents of the invention [0004] Embodimen...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B08B9/043F16L41/03F16L55/07H01L21/67
CPCB08B9/0436F16L41/03F16L55/07H01L21/67069
Inventor 付琦龙
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD