Differential-type pressure winding expansion and heat dissipationLED street lamp module

Abstract

The invention discloses a differential-type pressure winding expansion and heat dissipationLED street lamp module. The differential-type pressure winding expansion and heat dissipationLED street lampmodule includes a hollow differential-type heat conduction device whose one part including a central box, an L-shaped diversion pipe and a heat conduction flat pipe, and winding-type extension fin extended heat dissipation of the heat conduction flat pipe is realized; and the other part of the differential-type heat conduction device includes an integrated hip, a light source pressing plate, a sealing ring, a lens, a module mounting plate, and the like which are mounted in a dismounting and combine mode to form the LED street lamp module. The differential-type pressure winding expansion and heat dissipationLED street lamp module focuses on solving the technical characteristics of the integrated LED chip; practical application is realized under the higher outdoor temperature, and a core technical standard in implementing is to control the safe temperature of a junction temperature point TJ of the integrated LED chip; and the service life of the integrated LED chip is prolonged truly, alight source is cleaned, the luminous flux is enhanced, and a national standard detection foundation is laid; and a modular mounting structure greatly facilitates replacement of an existing market LEDstreet lamp, a projection lamp, stadium lighting and other light sources, and later maintenance.

Description

technical field [0001] The invention relates to an LED lighting module, in particular to an LED street lamp module with a differential pressure winding extended heat dissipation. Background technique [0002] Due to the operation of the integrated LED chip, the direct current passes through the semiconductor chip during photoelectric conversion to generate a junction temperature Tj, and the higher the junction temperature, the more serious the light decay, which affects the performance and life of the semiconductor LED. According to the LED heat dissipation formula: [0003] Tj℃=Ric×VF×IF+Tc [0004] RBA℃ / W=Tc-Ta÷VF×IF [0005] RJA=RJC+RBA [0006] It can be seen from the above formula that in order to increase the working life of LED and reduce the light decay, in addition to choosing the matching voltage and current, relatively reducing the RJA coefficient and RBA coefficient, the most important thing is to improve the heat dissipation and conduction mode and speed of T...

AI Technical Summary

Problems solved by technology

[0007] LED lighting devices on the market generally use aluminum profiles for heat dissipation, because of their large thermal resistance, they cannot meet the technical characteristics of high-power LED heat dissipation

[0008] At present, in the essential sense, the use of material properties to improve the heat conduction speed and heat dissipation intensity of heat sinks has not yet met the application technical characteristics of high-power LEDs.

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