Display panel and display device

Abstract

Embodiments of the present invention provide a display panel and a display device, relate to the field of display technology, and improve the packaging effect and reliability of the display panel. The display panel includes: a display area and a non-display area, the non-display area includes the lower step area, the lower step area includes the fan-shaped area and the bonding area, the fan-out area is provided with fan-out wiring, and the bonding area is provided with a negative power pad; layer, the cathode layer includes a cathode connection part located in the lower step area; a negative power bus located in the lower step area; the lower step area also includes a cathode contact area, and the negative power bus is connected to the cathode connection part in the cathode contact area; the lower step area There is a negative power connection part, and the negative power connection part and the fan-out wiring are arranged in different layers, and the negative power connection part is electrically connected to the negative power bus and a negative power pad; the negative power connection part includes a plurality of edge The first connecting parts extending in the first direction and arranged along the second direction have intervals between two adjacent first connecting parts.

Description

【Technical field】 [0001] The present invention relates to the field of display technology, in particular to a display panel and a display device. 【Background technique】 [0002] In order to prevent water and oxygen from corroding the devices in the display panel, an encapsulation glue is usually provided in the display panel. During the encapsulation process, the encapsulation glue is irradiated with laser to make it melt and solidify, so as to realize the encapsulation of the display panel. [0003] Usually, the non-display area of ​​the display panel includes the lower step area, such as figure 1 as shown, figure 1 It is a partial cross-sectional view of a display panel in the prior art. The lower step area is provided with a negative power signal line 1' and a fan-out line 2', and the fan-out line 2' is arranged in different layers. In the prior art, based on the arrangement of the negative power signal line 1', there will be a large overlap between the negative power s...

AI Technical Summary

Problems solved by technology

In the prior art, based on the arrangement of the negative power signal line 1', there will be a large overlap between the negative power signal line 1' and the fan-out wiring 2' in a local area. The film layer formed by stacking the power signal line 1' and the fan-out line 2' is not flat, and there is a large height difference between the area where the negative power signal line 1' is located and others, which makes the height of the encapsulation glue 3' covered on it uneven. , when the encapsulation adhesive 3' is melted and solidified, the deformation and stress caused by the thermal expansion and contraction of the encapsulation adhesive 3' at different positions are different, so that the encapsulation adhesive 3' is prone to wrinkle at the position with high stress, which reduces the reliability of the encapsulation ; On the other hand, when the encapsulation glue 3' is sintered by laser, it is blocked by the negative power signal line 1', and the reflection path of the laser in a local area is too short, which is obviously different from the reflection path in other areas, which affects the encapsulation glue 3 'The sintering uniformity, the packaging glue 3' is prone to cracks in high temperature and high humidity environment, resulting in package failure

Images