Process design method and system based on system packaging technology, medium and apparatus

A technology of process design and system packaging, applied in computer-aided design, calculation, comprehensive factory control, etc., can solve the problems of cumbersome and error-prone manufacturing process, and achieve the effect of reducing manufacturing risk, work difficulty and production cost.

Active Publication Date: 2019-09-03
VAYO SHANGHAI TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a process design method, system, medium and equipment based on system packaging technology, which is used to solve the unavoidable repetitive work in the prior art, and the manufacturing process cumbersome and error-prone questions

Method used

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  • Process design method and system based on system packaging technology, medium and apparatus
  • Process design method and system based on system packaging technology, medium and apparatus
  • Process design method and system based on system packaging technology, medium and apparatus

Examples

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Embodiment 1

[0040] This embodiment provides a process design method based on system packaging technology. The process design method based on system packaging technology includes:

[0041] Obtaining design data of a layout and 3D model data associated with the layout;

[0042] Associating and matching the design data and the three-dimensional model data according to the design component attribute information in the design data, and assembling the design data and the three-dimensional model data into an overall packaging model;

[0043] Performing assembly process analysis on the overall packaging model to analyze unreasonable design points used as design modifications and references, the assembly process analysis is to perform design specifications and system performance detection on the overall packaging model; or

[0044] A packaging process manufacturing program for manufacturing is directly derived from the overall packaging model.

[0045] The following will combine Figure 1A and ...

Embodiment 2

[0074] This embodiment provides a process design system based on system packaging technology. The process design system based on system packaging technology includes:

[0075] An acquisition module, configured to acquire design data of a layout and 3D model data associated with the layout;

[0076] A model generation module, configured to associate and match the design data and the three-dimensional model data according to the design element attribute information in the design data, and assemble the design data and the three-dimensional model data into an overall packaging model;

[0077] The production analysis module is used to analyze the assembly process of the overall package model to analyze unreasonable design points used as design modification and reference; or directly derive a package for manufacturing from the overall package model Craft manufacturing procedure.

[0078] The process design system based on the system packaging technology provided by this embodiment ...

Embodiment 3

[0089] This embodiment provides a device, including: a processor and a memory; the memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory, so that the device executes the system-based encapsulation Technological process design methods.

[0090] see image 3 , which is a device connection diagram in an embodiment of the process design method based on the system packaging technology of the present invention. Described equipment comprises: processor 31, memory 32, transceiver 33, communication interface 34 or / and system bus 35; Memory 32 and communication interface 34 are connected with processor 31 and transceiver 33 by system bus 35 and complete mutual communication Communication, the memory 32 is used to store computer programs, the communication interface 34 is used to communicate with other devices, the processor 31 and the transceiver 33 are used to run computer programs, so that the devices execute the pr...

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Abstract

The invention provides a process design method and system based on a system packaging technology, a medium and an apparatus. The process design method based on the system packaging technology comprises the following steps of acquiring the design data of a layout and the three-dimensional model data associated with the layout; associating and matching the design data and the three-dimensional modeldata according to the design element attribute information in the design data, and assembling the design data and the three-dimensional model data into an integral packaging model; performing assembly process analysis on the integral packaging model to analyze unreasonable design points used as design modification and reference; or directly exporting a packaging process manufacturing procedure for production and manufacturing from the integral packaging model. According to the method, more repeated work can be removed, the manual work is replaced with automation, and compared with an originalmethod, the method saves 60%-80% of the time, and meanwhile, the working difficulty is reduced, and the process from design to simulation and production manufacturing is simplified, so that the competitiveness of an electronic product is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of system packaging, and relates to a design method of system packaging technology, in particular to a process design method, system, medium and equipment based on system packaging technology. Background technique [0002] In the past hundred years, with the rapid development of electronic technology, the size of electronic products has become smaller and smaller, and the performance of electronic products has become higher and higher, from micron to nanoscale, which has led to higher and higher requirements for the electronic manufacturing industry. . Packaging is the post-processing process of electronic products. Traditional packaging mainly completes three major functions: one is to protect the core functions of electronics from external influence or damage; the other is to interconnect electronic functions with the outside world to realize electronic devices. The third is physical scale compatibility. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/367G06F2113/20G06F2113/18G06F30/398G06F30/392G06F2111/20G06F2119/18
Inventor 钱胜杰武纪宏刘继硕刘丰收
Owner VAYO SHANGHAI TECH
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