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Heating device and spraying type gluing machine

A technology of heating device and gluing machine, which can be applied to the device for coating liquid on the surface, coating, surface pretreatment, etc., and can solve the problem of uneven heating and drying of the heating device.

Pending Publication Date: 2019-09-06
BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The first object of the present invention is to provide a heating device, in order to solve the technical problem of uneven heating in the existing wafer heating device

Method used

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  • Heating device and spraying type gluing machine
  • Heating device and spraying type gluing machine
  • Heating device and spraying type gluing machine

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Experimental program
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Effect test

Embodiment

[0041] This embodiment provides a heating device, such as Figure 1 to Figure 4 As shown, the heating device 100 includes a heating plate 120 and a suction cup 130, and the heating plate 120 is arranged opposite to the suction plate 130; the heating plate 120 is divided into a plurality of heating zones, and each heating zone is correspondingly provided with a heating element, and a plurality of heating zones correspond to a heating element. As for the heating surface, the sucker has a heating surface, and the heat transfer surface is arranged opposite to the heating surface, and surface contact is adopted between the two surfaces.

[0042] In the heating device, a heating element is arranged in the heating plate 120 , and the heating element will generate heat when it works, and the heat can be transferred from the heating plate 120 to the suction cup 130 , so as to realize heating or drying of the product adsorbed on the suction cup 130 . During this process, since the hot p...

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Abstract

The invention provides a heating device and a spraying type gluing machine, and relates to the technical field of gluing equipment. The technical problem that hot drying is not uniform in an existingwafer heating device is solved. The heating device comprises a hot disc and a suction cup, the hot disc is arranged opposite to the suction cup, the hot disc is divided into a plurality of heating zones, the heating zones are correspondingly provided with heating elements, the heating zones correspond to one heat transfer surface, the suction cup is provided with a heated surface, the heat transfer surface is opposite to the heated surface, and the heat transfer surface is in surface contact with the heated surface. The spraying type gluing machine comprises a rack, the heating device and a driving mechanism for driving the heating device to rotate. The heating device and the spraying type gluing machine can provide a high-uniformity heat field.

Description

technical field [0001] The invention relates to the technical field of gluing equipment, in particular to a heating device and a spray gluing machine. Background technique [0002] The spray coating machine is suitable for uniform coating of photoresist on substrates with high ruggedness, which can effectively meet the requirements of TSV, MEMS and other manufacturing processes. [0003] The spray coating machine generally uses an ultrasonic nozzle to atomize the photoresist, and the nozzle is driven by the XY table to precisely spray the wafer fixed on the substrate by vacuum adsorption. The spraying process of the spray coating machine is generally completed by multiple sprayings. When the spraying head finishes a certain spraying, the XY table drives the spraying head to the next spraying position, and the wafer carrier drives the wafer to rotate, and then starts the next spraying of the wafer; During the spraying process, it is generally necessary to bake the wafer bein...

Claims

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Application Information

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IPC IPC(8): B05C13/02B05C9/14B05D3/02
CPCB05C13/02B05C9/14B05D3/0254Y02P70/50
Inventor 贾月明吕磊吴卿刘玉倩郑如意李嘉保
Owner BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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