Laser cutting device

A technology of laser cutting and cutting mechanism, applied in glass cutting devices, manufacturing tools, glass manufacturing equipment, etc., can solve problems such as increasing cost, increasing process, reducing yield, etc., to improve yield, uniform thermal stress, and avoid broken cracked effect

Active Publication Date: 2021-06-08
SHENZHENSHI YUZHAN PRECISION TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned cut glass workpieces are prone to edge chipping, and the edge strength of the glass workpiece is weak, and subsequent CNC cutting processing is required, which increases the process and increases the cost.
At the same time, glass cutting equipment that uses lasers to process glass workpieces has complex processes and fragments are prone to occur during the slitting process, which reduces the processing yield

Method used

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  • Laser cutting device
  • Laser cutting device
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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0017] It should be noted that when an element or component is considered to be “connected” to another element or component, it may be directly connected to the other element or component or there may be an intervening element or component at the same time. When an element or component is referred to as being "disposed on" another element or component, it can be directly disposed on the other element or component or intervening elements or compone...

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Abstract

The invention proposes a laser cutting device, which includes a machine table, a transmission mechanism, a cutting mechanism and a split mechanism. The cutting mechanism includes a mobile platform and a laser cutter. The mobile platform is used to place workpieces and drive the workpieces to move according to a preset route. The cutter is used to emit a laser beam to pre-cut the workpiece on the mobile platform and form a pre-cut line. The laser cutting device also includes a static mechanism. The static mechanism includes a fixed frame, a bearing plate and two clamping components, each The clamping assembly includes a clamping member and at least one clamping driver, each clamping driver is arranged on the bearing plate and is close to one side edge of the bearing plate, and the clamping member is arranged on each clamping driver and on the corresponding Driven by the clamping driver to move against the workpiece to clamp and fix the workpiece and let the workpiece stand for a preset time, the split mechanism heats the workpiece after standing along the pre-cutting line, so that the workpiece along the pre-cutting line The wire is split to realize the cutting of the workpiece.

Description

technical field [0001] The invention relates to a cutting device, in particular to a laser cutting device for cutting glass workpieces. Background technique [0002] Existing glass cutting equipment mainly adopts traditional glass cutters to cut workpieces. However, the above-mentioned cut glass workpiece is prone to edge chipping, and the edge strength of the glass workpiece is weak, and subsequent CNC cutting processing is required, which increases the manufacturing process and increases the cost. At the same time, glass cutting equipment that uses lasers to process glass workpieces is complex and prone to fragmentation during the slitting process, which reduces the processing yield. Contents of the invention [0003] In view of the above situation, it is necessary to provide a laser cutting device that can realize automation and has high cutting yield. [0004] A laser cutting device is used for processing workpieces. The laser cutting device includes a machine table,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B33/02C03B33/033
CPCC03B33/0222C03B33/033
Inventor 杨关伟王有德张红岩丁培
Owner SHENZHENSHI YUZHAN PRECISION TECH CO LTD
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