A contact broadband radio frequency interconnection method and structure

Abstract

The invention provides a contact type broadband radio frequency interconnection method and structure, comprising a flexible conductive material fixedly arranged between a radio frequency component anda radio frequency motherboard as an electric signal transmission medium and contacted with the radio frequency component and the radio frequency motherboard respectively; The invention also comprisesa crimping fixing structure, a crimping RF assembly, a flexible conductive material and a RF motherboard to ensure the stability of the contact connection between the flexible conductive material andthe RF assembly and the RF motherboard. Compared with the existing BGA interconnection scheme, it can effectively release the thermal stress between the RF module and the RF motherboard due to the different thermal expansion coefficient of the material in the process of high and low temperature, and then improve the reliability of the module in the process of using. In addition, weld-free features can significantly improve the efficiency of component testing, assembly, and rework phases, and can be quickly extended to other product integration.

Description

technical field [0001] The invention relates to a contact type broadband radio frequency interconnection method and structure, and relates to the field of broadband radio frequency interconnection. Background technique [0002] The flat panel microsystem based on RF components + RF master is the mainstream form of next-generation microwave products. At present, most broadband RF components are made of ceramic materials, and the interconnection between components and motherboards is mostly in the form of a ball array (BGA) package similar to digital devices. The signal interconnection is realized by welding the BGA ball and the RF motherboard, and the signal transmission frequency range can reach DC-40GHz. [0003] In a typical BGA interconnection method of radio frequency components, the substrate of radio frequency components is made of low temperature co-fired ceramic (LTCC) material. By drilling holes in LTCC and implanting BGA solder balls with tin as the main cost, the ...

AI Technical Summary

Problems solved by technology

[0005] 1) There is a thermal mismatch between the ceramic substrate materials used in RF components (such as LTCC, HTCC, etc.) and the RF master material. Under high and low temperature conditions, large thermal stress will be generated, which will affect product reliability.

[0006] 2) High-density placement of RF components on the RF master board, the integration and repair process is difficult and the yield rate is low;

[0007] 3) Lack of non-destructive testing methods for RF components based on BGA packaging

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