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Substrate, substrate production method and package structure

A production method and substrate technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of poor longitudinal heat dissipation performance and limited application of graphite layer heat dissipation, and achieve the effect of improving heat dissipation performance, improving heat dissipation performance, and strong thermal conductivity.

Inactive Publication Date: 2019-09-20
UNIV OF ELECTRONICS SCI & TECH OF CHINA ZHONGSHAN INST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The horizontal heat dissipation performance of the graphite layer is good, but the vertical heat dissipation performance is poor. In the application field where the LED chip requires a high vertical heat dissipation capability, the heat dissipation application of the graphite layer is greatly restricted

Method used

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  • Substrate, substrate production method and package structure
  • Substrate, substrate production method and package structure
  • Substrate, substrate production method and package structure

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Embodiment Construction

[0026] This part will describe the specific embodiment of the present invention in detail, and the preferred embodiment of the present invention is shown in the accompanying drawings. Each technical feature and overall technical solution of the invention, but it should not be understood as a limitation on the protection scope of the present invention.

[0027] In the description of the present invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc. indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

[0028] I...

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Abstract

The invention discloses a substrate, a substrate production method and a package structure. The substrate comprises a wiring layer and a heat dissipation layer, wherein a heat-conducting insulation layer is disposed between the wiring layer and the heat dissipation layer; the heat dissipation layer comprises a carrier and heat-conducting fibers longitudinally arranged on the carrier. The heat-conducting fibers have excellent thermal conductivity and are longitudinally arranged on the carrier so as to improve the heat dissipation performance of the heat dissipation layer in the longitudinal direction, thereby improving the heat dissipation performance of the entire substrate in the longitudinal direction.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a substrate, a production method of the substrate and a packaging structure. Background technique [0002] With the development of the LED industry, LED chips and their packages develop rapidly, and the packaging volume of LED chips is getting smaller and smaller. At the same time, the power of the chip inside the package is increasing, which leads to a higher temperature rise in the package. As the temperature rises, if the heat of the LED chip itself cannot be dissipated quickly, it is easy to cause the LED chip to fail or cause serious light decay due to excessive temperature, thereby greatly reducing the life of the LED chip and its package. Heat generation has been considered as one of the important technical issues faced by LED chip package design. Therefore, the heat dissipation problem of LED is the top priority. [0003] At present, LED chips mainly rely on substrates fo...

Claims

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Application Information

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IPC IPC(8): H01L33/64H01L33/62
CPCH01L33/62H01L33/642H01L2933/0066H01L2933/0075
Inventor 王可徐梦雪王悦辉
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA ZHONGSHAN INST
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