Systems and methods for rotating and translating a substrate in a process chamber

Abstract

Disclosed herein are systems and methods related to a handling system used to move a semiconductor substrate within a process chamber during treatment. The handling system moves the substrate back-and-forth between two locations in an arc-like motion around a pivot point, while simultaneously rotating the substrate around its own center point.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to U.S. Provisional Application No. 62 / 451,499, entitled "Systems and Methods for Rotating and Translating a Substrate in a Process Chamber," filed January 27, 2017, and is incorporated herein by reference in its entirety . Background technique [0003] IC fabrication can be performed by applying and selectively removing various materials on microelectronic substrates. One aspect of the fabrication process may include exposing the surface of the microelectronic substrate to a cleaning process to remove process residues and / or debris (eg, particles) from the microelectronic substrate. Various dry and wet cleaning techniques have been developed to clean microelectronic substrates to improve yield and device performance. However, the increased density of active components (eg, smaller device features) makes devices more susceptible to physical damage from power cleaning processes and yield...

AI Technical Summary

Problems solved by technology

However, the size of the linearly translating member (e.g. rod) requires a much larger chamber volume than the substrate and increased frictional surface area within the process chamber as the size of the substrate diameter increases

Additionally, larger chamber volumes increase cost (e.g., longer pump down times, more chemicals, and larger footprint) without a corresponding increase in process performance

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