Ultrasonic vibration auxiliary CMP method for complex curved surface impeller blade
An impeller blade and complex curved surface technology, which is applied in the field of ultrasonic vibration-assisted CMP, can solve the problems of complex curved impeller blade processing equipment, inability to process large-sized complex curved surface parts, and complicated operation, and achieve the effect of smooth automatic polishing processing.
Active Publication Date: 2019-09-24
DALIAN UNIV OF TECH +1
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Problems solved by technology
However, abrasive flow polishing and CNC electrolytic polishing require special high-end equipment, and the operation is complicated. There are many influencing factors in the polishing process, and it is difficult to control the polishing quality. Manual polishing is not only inefficient, difficult to guarantee the polishing quality, but also endangers the health of the operator. ,high cost
[0004] In summary, traditional CMP and ultrasonic vibration machining are basically unable to process large-sized complex curved surface parts, and the existing processing methods of complex curved surface impeller blades have problems such as complex processing equipment, high processing costs, and difficulty in guaranteeing processing quality and processing efficiency.
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[0023] specific implementation plan
[0024] The present invention will be further described below in conjunction with the accompanying drawings.
[0025] An ultrasonic vibration-assisted CMP method for impeller blades with complex curved surfaces, the specific implementation steps are as follows:
[0026] 1) Select an ultrasonic vibrating plate 5 with adjustable power, the maximum power is 600W, and the fixed frequency is 48KHZ, and paste it on the inner wall of the container 2;
[0027] 2) In container 2, add nitric acid solution (65wt%) respectively, the volume content in the polishing solution is 3.5%; Hydrofluoric acid solution (40wt%), the volume content in the polishing solution is 0.7%; Phosphoric acid solution (85wt%) %), the volume content in the polishing solution is 5%; the hydrogen peroxide solution (30wt%), the volume content in the polishing solution is 4%; the nonylphenol polyoxyethylene ether solution (10wt%), in the polishing solution The content is 4.2g / L;...
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Abstract
The invention discloses an ultrasonic vibration auxiliary CMP method for a complex curved surface impeller blade. According to the ultrasonic vibration auxiliary CMP method, under assistance of an ultrasonic vibration device, softening corrosion is conducted on the blade through chemical polishing solution, in addition, the blade rotates, thereby being fast hit and scraped by abrasives with high frequency, residual materials on the surface of the blade are removed, and chemical-mechanical polishing of the blade is completed. Through the ultrasonic vibration auxiliary CMP method, any complex curved surface impeller blades can be polished automatically and precisely, and imported special equipment and manual polishing are replaced.
Description
technical field [0001] The invention relates to a processing method of an impeller, in particular to an ultrasonic vibration-assisted CMP method for impeller blades with complex curved surfaces. Background technique [0002] Chemical mechanical polishing (CMP) is a polishing method that smoothes the surface of the polished part through the chemical action of the chemical reagent in the polishing liquid and the mechanical force coupling of the abrasive grains. It is currently mainly used in small flat parts, such as sapphire lining. Bottom, silicon wafer, copper sheet, etc. Ultrasonic vibration processing is to drive the abrasive particles in the solution to hit the surface of the processed part quickly and at high frequency through ultrasonic vibration. This method is often used to clean the part, or combine with the machine tool, and then cut the workpiece, such as glass, quartz and other materials. Hole, cutting processing. [0003] The size of the impeller blade is rela...
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IPC IPC(8): B24B1/04B24B19/14C09G1/02
CPCB24B1/04B24B19/14C09G1/02
Inventor 张振宇廖龙兴张勇舒鑫柳鹏雍建华
Owner DALIAN UNIV OF TECH