A kind of low melting point low silver cadmium-free silver solder
A technology of silver solder with low melting point, which is applied in welding/cutting media/materials, metal processing equipment, welding equipment, etc., and can solve the problem of no wetting and spreading performance, mechanical properties of brazing seam, and no value for mass application , Silver solder processing difficulties and other problems, to avoid oxidation or even softening of the workpiece, good wetting and spreading, and easy to operate
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0021] A low-melting-point low-silver cadmium-free silver solder is characterized in that the ratio by mass percentage is: 11.0% Ag, 43.0% Zn, 0.01% Sn, 0.05% In, 0.01% Zr, 0.05% Sc, the balance is Cu.
[0022] The low-melting-point low-silver cadmium-free silver solder obtained by adopting the above-mentioned composition ratio has a solidus temperature of ≤765°C and a liquidus temperature of ≤795°C (measurement errors are considered). See the data in brackets for the strength of the brazing seam when the flame brazing method is used, with FB102 flux, and the brazing base material is the following combination: red copper-H62 brass (σ b =225±10MPa, τ=215±10MPa), brass-Q235 steel (σ b =300±10MPa, τ=310±10MPa), brass-304 stainless steel (σ b =300±10MPa, τ=310±10MPa).
Embodiment 2
[0024] A low-melting-point low-silver cadmium-free silver solder is characterized in that the ratio by mass percentage is: 13.0% Ag, 36.0% Zn, 0.05% Sn, 0.01% In, 0.05% Zr, 0.01% Sc, the balance is Cu.
[0025] The low-melting-point low-silver cadmium-free silver solder obtained by adopting the above-mentioned composition ratio has a solidus temperature of ≤765°C and a liquidus temperature of ≤795°C (measurement errors are considered). See the data in brackets for the strength of the brazing seam when the flame brazing method is used, with FB102 flux, and the brazing base material is the following combination: red copper-H62 brass (σ b =225±10MPa, τ=215±10MPa), brass-Q235 steel (σ b =300±10MPa, τ=310±10MPa), brass-304 stainless steel (σ b =300±10MPa, τ=310±10MPa).
Embodiment 3
[0027] A low-melting point low-silver cadmium-free silver brazing material is characterized in that the ratio by mass percentage is: 12.0% Ag, 39.0% Zn, 0.025% Sn, 0.03% In, 0.025% Zr, 0.03% Sc, the balance is Cu.
[0028] The low-melting-point low-silver cadmium-free silver solder obtained by adopting the above-mentioned composition ratio has a solidus temperature of ≤765°C and a liquidus temperature of ≤795°C (measurement errors are considered). See the data in brackets for the strength of the brazing seam when the flame brazing method is used, with FB102 flux, and the brazing base material is the following combination: red copper-H62 brass (σ b =225±10MPa, τ=215±10MPa), brass-Q235 steel (σ b =300±10MPa, τ=310±10MPa), brass-304 stainless steel (σ b =300±10MPa, τ=310±10MPa).
PUM
Property | Measurement | Unit |
---|---|---|
solidus temperature | aaaaa | aaaaa |
liquidus temperature | aaaaa | aaaaa |
temperature | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap