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A method for measuring heat dissipation bottlenecks of high-power heat pipe radiators

A heat pipe radiator and measurement method technology, applied in the direction of machine/structural component testing, instruments, measuring devices, etc., can solve the problem of finding no qualified solution, lack of pertinence, randomness and uncertainty of design results, and difficulty in guiding Improve the direction of radiators and other issues to achieve the effect of scientific measurement methods

Active Publication Date: 2021-06-01
STATE GRID HUNAN ELECTRIC POWER +2
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  • Claims
  • Application Information

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Problems solved by technology

This design adjustment process is based on the designer's experience and judgment to make continuous attempts, such as changing the number and shape of fins, adjusting the shape and combination of heat pipes, changing the size of the substrate, etc. Product design and solutions depend on the designer's experience, lack of Pertinence, design results also have great randomness and uncertainty, which will lead to multiple attempts and still not find a qualified solution, or find a qualified solution but the technical and economic indicators are not optimal
[0004] The current radiator test method is generally to test the overall performance index of the radiator, that is, the overall temperature rise or thermal resistance data of the radiator under a given heat source power and cooling medium flow rate. The result can judge whether the radiator performance is qualified, but it is difficult Guide the direction of radiator improvement

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  • A method for measuring heat dissipation bottlenecks of high-power heat pipe radiators
  • A method for measuring heat dissipation bottlenecks of high-power heat pipe radiators
  • A method for measuring heat dissipation bottlenecks of high-power heat pipe radiators

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Embodiment Construction

[0030] The present invention will be described in detail below in combination with specific embodiments.

[0031] This high-power heat pipe radiator heat dissipation bottleneck measurement method provided by the invention, such as figure 1 shown, including the following steps:

[0032] Step 1. According to the structural characteristics of the radiator, it can be seen that the heat transfer process is conducted by the heat source through the substrate and heat pipes to the fins, and then the fins exchange heat with the air, and then the heat is discharged by the hot air (such as figure 2 shown), considering that the heat pipe or fin is composed of multiple monomers and the relative positions of each unit are quite different, the heat transfer process is not a simple one-dimensional heat transfer but a three-dimensional heat transfer, in order to simplify the analysis and combine In the heat dissipation process, the whole substrate, two heat pipes directly below the substrate...

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Abstract

The invention discloses a method for measuring the heat dissipation bottleneck of a high-power heat pipe radiator, which belongs to the technical field of heat dissipation of electronic devices; the invention calculates the heat transfer temperature difference of each link and compares it with theoretical expectations by measuring the internal characteristic temperature point data of the radiator under rated working conditions Value comparative analysis, thereby finding the main link that restricts the overall performance of the heat pipe radiator, revealing the heat dissipation bottleneck of the heat pipe radiator, to guide the optimization and improvement direction of the heat pipe radiator; the invention overcomes the blindness in the design and evaluation of the heat pipe radiator, and can accurately Diagnose whether there is still much room for improvement in the performance of existing high-power radiators, and where to improve.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of electronic devices, and in particular relates to a method for measuring heat dissipation bottlenecks of high-power heat pipe radiators. Background technique [0002] With the rapid development of semiconductor power devices, the power density of a single device is getting higher and higher. At present, the power level of thyristors has reached 9kV / 12kA, GTO has reached 9kV / 10kA, and IGBT has reached 6.6kV / 3.5kA. Because these high-power semiconductor devices are rated High voltage, high rated current, large total heat generation and high heat density, require very high heat dissipation efficiency of the radiator, and its cooling and heat dissipation is also the core that restricts the volume, weight and reliability of high-power power electronic equipment. When air cooling is used for heat dissipation, a high-power heat pipe radiator is required. [0003] Since high-power heat pipe ra...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01M99/00G01N25/20
CPCG01M99/002G01M99/008G01N25/20
Inventor 陆佳政黄清军李波谭艳军朱思国朱远毛新果
Owner STATE GRID HUNAN ELECTRIC POWER