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Copper foil with carrier, copper clad laminate and printed circuit board

A carrier copper foil and carrier technology, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit components, etc., can solve problems such as adverse effects of circuits and lower product yield

Active Publication Date: 2021-11-02
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when bonding copper foil with a carrier to a resin base material by hot pressing, bubbles (bubbles) may occur between the ultra-thin copper foil and the carrier
Lower product yield due to foaming that adversely affects circuit formation

Method used

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  • Copper foil with carrier, copper clad laminate and printed circuit board
  • Copper foil with carrier, copper clad laminate and printed circuit board
  • Copper foil with carrier, copper clad laminate and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0043] The present invention is further specifically described by the following examples.

example 1、2 and 4～8

[0045] Preparation and evaluation of the copper foil with a carrier were performed as follows.

[0046] (1) Preparation of the carrier

[0047]As a carrier, an electrolytic copper foil with a thickness of 18 μm classified as Class 3 by the IPC standard was prepared. The electrolytic copper foil used as the carrier is a copper foil (so-called green foil) that remains in an electrolytic foil state, and is a copper foil that has not been subjected to surface treatment such as antirust treatment and roughening treatment. A pickling treatment is performed to remove oil and fat components adhering to the surface of the carrier and surface oxide film.

[0048] (2) Formation of peeling layer

[0049] The electrode surface side of the acid-washed carrier was immersed in a CBTA aqueous solution with a CBTA (carboxybenzotriazole) concentration of 1 g / L, a sulfuric acid concentration of 150 g / L, and a copper concentration of 10 g / L at a liquid temperature of 30° C. for 30 seconds. The ...

example 3

[0068] Example 3 (Compare)

[0069] Production and evaluation of the copper foil with a carrier were performed in the same manner as in Example 1 except that the copper foil with a carrier was not heat-treated. The results are shown in Table 1 and figure 1 shown.

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Abstract

The invention relates to a copper foil with a carrier, a copper clad laminate and a printed circuit board. The subject of this invention is providing the copper foil with a carrier which can remarkably suppress generation|occurrence|production of the blister accompanying hot-press lamination to a resin base material. The solution is a copper foil with a carrier, which has a carrier, a peeling layer, and an ultra-thin copper foil in sequence. The peeling layer contains a carboxyl group-containing compound and its derivatives. 2 The number of O molecules is 3.44×10 16 piece / cm 2 Below, and CO per unit area in copper foil with carrier 2 The number of molecules is 1.39×10 16 piece / cm 2 the following.

Description

technical field [0001] The invention relates to a copper foil with a carrier, a copper-clad laminate and a printed circuit board. Background technique [0002] As a material for manufacturing printed circuit boards, copper foil with a carrier is widely used. Copper foil with carrier is laminated with insulating resin substrates such as glass-epoxy substrates, phenolic substrates, and polyimide by hot pressing to make copper-clad laminates for the manufacture of printed circuit boards. [0003] Copper foil with a carrier typically has a configuration including a carrier, a release layer, and an ultra-thin copper foil in this order, and it has been proposed to use an organic release layer containing an organic compound as the release layer. For example, Patent Document 1 (Japanese Unexamined Patent Publication No. 2003-328178) discloses a method of manufacturing copper foil with a carrier, which includes: using a pickling solution containing 50 ppm to 2000 ppm of an organic r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B7/06B32B15/08B32B15/20B32B33/00B32B37/06B32B37/00
CPCB32B7/06B32B15/08B32B15/20B32B33/00B32B37/003B32B37/06B32B2457/08C25D5/10C25D5/605B32B5/022B32B5/024B32B15/09B32B15/092B32B15/12B32B15/14B32B17/061B32B27/20B32B27/281B32B27/36B32B27/38B32B2260/021B32B2260/046B32B2262/101B32B2264/102B32B2307/732C23C18/165C23C18/1653C23C18/38C25D1/04C25D3/38C25D3/565C25D7/0614H05K3/025H05K3/384H05K3/389B32B15/01H05K1/09
Inventor 细川真高梨哲聪西田琢磨
Owner MITSUI MINING & SMELTING CO LTD