Heat dissipation structure

Abstract

The invention provides a heat dissipation structure. The heat dissipation structure comprises a substrate and a radiator, wherein the back surface of the substrate is provided with a wedge-shaped groove and a wedge-shaped bulge, wherein the wedge-shaped groove and the wedge-shaped bulge are arranged in a preset arrangement mode; a wedge-shaped groove and a wedge-shaped bulge which are matched withthe back surface of the substrate are arranged on the surface of the radiator; and the cross section of the wedge-shaped groove and the cross section of the wedge-shaped bulge in the preset arrangement mode are in a zigzag shape. The contact surface of the substrate and the radiator is sawtooth-shaped, so that the contact area and the pressure on the contact surface are increased, the contact heat resistance between the radiator and the substrate is reduced, and the heat dissipation efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of photoelectric components, in particular to a heat dissipation structure. Background technique [0002] Existing photoelectric components have the problem of poor heat dissipation. There are three existing heat dissipation methods, including increasing the effective contact area between the substrate and the heat sink, increasing the thermal conductivity of the heat transfer medium between the substrate and the heat sink, and reducing the thermal conductivity of the heat transfer medium. thickness of. [0003] Direct contact between the substrate and the heat sink is theoretically the most ideal heat conduction method without the need for an intermediate medium, but in fact its heat dissipation effect is the worst, because the back of the substrate and the surface of the heat sink are very smooth and flat under naked eye observation. , but it is very rough at the microscopic scale, wit...

AI Technical Summary

Problems solved by technology

[0005] In addition, the substrate is directly soldered to the heat sink with solder paste, the effective contact area is large and it will not bulge. The thermal conductivity of solder is 67 W / m·degree, although it is not as good as copper and aluminum, it is higher than thermal paste and thermal grease. There are many, but the disadvantage is that it cannot be easily replaced. If you need to replace it, you must remove the entire radiator and take it to the heating table to melt the solder. All components will be affected. Bubbles and cavities will be generated at any time, and if the cavities are large, it will affect the local heat dissipation

[0006] Therefore, the existing heat dissipation structure has been plagued by the heat dissipation problems of high-power electronics, electrical components and high-power LEDs.

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