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Systems and methods for depositing thin film onto flexible substrate

A flexible substrate and substrate technology, applied in liquid chemical plating, manufacturing tools, vacuum evaporation plating, etc., can solve the problems of incomplete elimination of substrate height changes, substrate tearing, uneven deposition layers, etc.

Inactive Publication Date: 2019-10-18
GLOBAL SOLAR ENERGY INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Variations in the height of the substrate relative to the heat source below and the bath level above can affect factors such as depth in solution, mixing and heat transfer, resulting in inhomogeneities in the deposited layer
Therefore, it is desirable to keep the substrate flat during deposition; however, known solutions for conveying the substrate flat through the deposition zone have disadvantages
For example, mechanically holding the substrate across the underlying backplane at high tension is difficult and does not completely eliminate variations in substrate height
Magnets or a vacuum can be used to pull the substrate flat against the backing plate, but the friction in this configuration often causes the substrate to tear, especially if the bath seeps from underneath

Method used

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  • Systems and methods for depositing thin film onto flexible substrate
  • Systems and methods for depositing thin film onto flexible substrate
  • Systems and methods for depositing thin film onto flexible substrate

Examples

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Embodiment Construction

[0016] Various aspects and examples of systems for depositing thin film semiconductor layers onto flexible substrates and associated methods are described below and illustrated in the associated drawings. Unless otherwise specified, a system for thin film deposition and / or its various components may, but is not required to, incorporate at least one of the structures, components, functions and / or variations described, illustrated and / or incorporated herein . Furthermore, unless specifically excluded, the process steps, structures, components, functions and / or changes described, illustrated and / or incorporated herein in connection with the present teachings may be included in other similar devices and methods, including in the disclosed Embodiments are interchangeable. The following description of various examples is merely exemplary in nature and is in no way intended to limit the disclosure, its application, or uses. Additionally, the advantages provided by the examples and ...

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Abstract

Systems and methods for depositing a thin film layer onto a flexible ferromagnetic substrate include a porous block in a deposition zone and a plurality of magnets embedded within the porous block. The magnets provide a downward force on a flexible ferromagnetic substrate being transported over the porous block, e.g., in a reel-to-reel system. Pressurized gas is forced upward through the porous block, providing an upward force that balances the downward force and supports the substrate at a desired height above the porous block. The substrate is thus held flat during transport through the deposition zone, enabling uniform deposition of a thin film layer.

Description

technical field [0001] The present disclosure relates to systems and methods for depositing thin film layers onto flexible substrates. More specifically, the disclosed embodiments relate to magnetic air bearings for transporting flexible substrates through a deposition zone. Background technique [0002] Thin film coatings (eg, semiconducting layers) can be applied to flexible substrates by chemical deposition. The deposition process may include conveying the substrate through a temperature-controlled chemical bath deposition zone. Chemical bath deposition is generally very sensitive to changes in substrate planarity. Variations in the height of the substrate relative to the heat source below and the bath level above can affect factors such as depth in solution, mixing and heat transfer, leading to inhomogeneities in the deposited layer. Therefore, it is desirable to keep the substrate flat during deposition; however, known solutions for conveying the substrate flat throu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/16C23C14/35C23C14/56C23C16/54
CPCC23C14/35C23C14/562C23C16/545C23C18/1673C23C18/12C23C18/1204H01L21/67709H01L21/6776B23Q3/1546C23C18/08C23C18/1283H01L21/02203H01L21/02425H01L21/02628H01L21/28556
Inventor 斯科特·维德曼
Owner GLOBAL SOLAR ENERGY INC