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Substrate processing equipment

A substrate processing device and substrate technology, applied in the direction of grinding devices, abrasive surface adjustment devices, grinding machine tools, etc., can solve the problems of adverse effects on the grinding quality of the substrate, uneven rotation speed and friction force of the grinding disc 10, etc., and improve the grinding quality , to solve the effect of fluctuations

Active Publication Date: 2022-05-13
K C TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the rotational speed and frictional force of the grinding disk 10 are not uniform, and there is a problem that the polishing quality of the substrate is adversely affected.

Method used

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  • Substrate processing equipment
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Embodiment Construction

[0036] The present invention will be described in detail below with reference to the accompanying drawings. However, in describing the present invention, in order to clarify the gist of the present invention, specific descriptions of well-known functions or configurations are omitted.

[0037] like Figure 4 As shown, the substrate processing apparatus 100 of one embodiment of the present invention includes: a grinding disc 10, which is rotatably driven by a fixed disc motor Mp in a state where a grinding pad 11 is covered; Pressurize under the state and utilize head motor Mh to rotate; Regulator 40, it reforms the surface of polishing pad 11; The position of the polishing head 20 which is oscillatingly moved; the polishing head pressing force sensing part 115 which senses the polishing head pressing force 20F which presses the substrate W toward the polishing pad 11 by means of the polishing head 20; the regulator position sensing part 120, which senses the position of the ...

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Abstract

The present invention relates to a substrate processing device, and provides a substrate processing device that compensates for the load variation of a fixed plate motor based on the position and pressure of a polishing head and an adjuster, and controls the rotation of the fixed plate motor so as to keep constant without fluctuation. The frictional characteristics between the substrate and the polishing pad keep the rotation speed of the grinding disc constant and improve the quality determined by the grinding process of the substrate.

Description

technical field [0001] The present invention relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus that solves the problem of poor polishing quality caused by variations in the rotational speed of a polishing disc in a substrate polishing process. Background technique [0002] Chemical mechanical polishing (CMP) equipment is used to eliminate the wide area of ​​height difference between the cell area and the peripheral circuit area caused by the unevenness of the substrate surface caused by repeated masking, etching, and wiring processes during the semiconductor element manufacturing process. Planarization is a device used to perform precision grinding on the surface of the substrate by improving the surface roughness of the substrate due to the separation of contact / wiring film for circuit formation and high-integration components. [0003] In this CMP apparatus, before and after the polishing process, the carrier head press...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/11B24B37/34
CPCB24B37/11B24B37/34B24B37/005B24B37/04B24B53/017H01L21/304H01L21/30625H01L21/67092
Inventor 金圣教
Owner K C TECH