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Plated hole copper device

A technology of electroplating holes and electroplating tanks, applied in the direction of plating tanks, etc., can solve the problem of poor uniformity of copper thickness in holes, and achieve the effect of improving uniformity

Active Publication Date: 2020-09-29
枣庄睿诺光电信息有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is the defect of poor uniformity of the existing hole copper thickness, and then provides a kind of electroplating hole copper device

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] This embodiment provides a copper plating device, such as figure 1 and 2 As shown, it includes an electroplating tank 0 and an anode 2 and a cathode 3 arranged in the electroplating tank 0. Specifically, the shape of the electroplating tank 0 can be selected according to needs. For example, the electroplating tank 0 is a cubic electroplating tank, and it also includes,

[0050] The liquid spray pipe 4 is arranged between the anode 2 and the cathode 3, and is located in the electroplating tank 0. The extension direction of the liquid spray pipe 4 is consistent with the extension direction of the cathode 3 and the two are oppositely arranged, along the extension direction of the liquid spray pipe 4 Above, a plurality of nozzles 5 are arranged at intervals on the liquid spray pipe 4 to spray the electroplating solution toward the surface of the cathode 3; specifically, the liquid spray pipe 4 is a straight pipe, and several nozzles 5 are arranged at intervals on the side o...

Embodiment 2

[0057] This embodiment provides a copper plating device. On the basis of the above-mentioned embodiment 1, one end of the liquid spray pipe 4 is a liquid inlet end, and the opposite end is a closed end. Along the direction from the liquid inlet end to the closed end, adjacent The distance between the nozzles becomes smaller, and this setting can avoid the influence of the pressure at different positions in the spray pipe 4 on the spray flow, so that the pressure of the electroplating solution sprayed by each nozzle tends to be consistent, thereby ensuring the uniformity of copper plating during the electroplating process ; Specifically, along the direction from the liquid inlet end to the closed end, the distance between adjacent nozzles decreases gradually in a gradient.

Embodiment 3

[0059] This embodiment provides a copper plating device. On the basis of the above-mentioned embodiment 1 or 2, as a variable embodiment, one end of the liquid spray pipe 4 is a liquid inlet end, and the opposite end is a closed end. In the direction from the end to the closed end, the opening area of ​​the previous nozzle is larger than that of the latter nozzle. This setting can also avoid the influence of the pressure of different positions in the spray pipe 4 on the spray flow, so that the pressure of the electroplating solution ejected from each nozzle tends to be consistent, thereby ensuring the uniformity of copper plating in the electroplating process; specifically, along the In the direction from the liquid end to the closed end, the opening area of ​​the nozzle is larger than that of the latter nozzle and gradually decreases in a gradient.

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Abstract

The invention provides an electroplating hole copper device. According to the electroplating hole copper device, liquid spraying pipes are arranged, a shielding plate is arranged between one liquid spraying pipe and a cathode, each shielding plate and the corresponding liquid spraying pipe are overlapped, the shielding plates are used for shielding the anodes or the cathode (namely, a product to be plated with copper) so as to reduce the action on a tip by the electric current-electric potential, and thus the thickness of the surface copper plated on a high-potential area and a low-potential area can be balanced; and a window opening area is arranged on the plate surface of each shielding plate located in the overlapping area, moreover, each windowing area is enabled to correspond to a nozzle on the corresponding liquid spraying pipe located in the overlapping area, so that electroplating liquid sprayed by the nozzles is sprayed on the surface of the cathode through the windowing areas, the electroplating liquid sprayed by the nozzles are prevented from being shielded by the shielding plates, the electroplating liquid can be sprayed on the surface of the product and can be effectively exchanged, and finally the thickness uniformity of the hole copper is improved.

Description

technical field [0001] The invention belongs to the technical field of electroplating, and in particular relates to an electroplating hole copper device. Background technique [0002] Flexible circuit board has the characteristics of high wiring density, light weight, thin thickness and good bendability. It is an important electronic component, a carrier of electronic components, and a carrier of circuit connection of electronic components. As an indispensable and important pillar of the information industry, with the rapid development of the information industry, high-precision thin lines have become the mainstream trend. [0003] In order to produce products with high precision and fine lines, the uniformity of the copper layer thickness of the circuit board is required to be high. There are higher requirements for uniformity. At present, in the actual operation process, it is difficult to control the uniformity of the hole copper thickness of double-sided or multi-layer ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/08C25D5/02C25D17/02C25D7/00
CPCC25D5/026C25D7/00C25D17/02
Inventor 金长帅
Owner 枣庄睿诺光电信息有限公司