Ceramic chip packaging bidirectional low junction capacitance TVS diode
A technology of low-junction capacitance and patch packaging, which is applied in the direction of circuits, electrical components, and electric solid-state devices, can solve the problems of large TVS tube consumption, unfavorable product integration, and small size, so as to achieve large installation space and realize integration Effect
Pending Publication Date: 2019-10-25
CHINA ZHENHUA GRP YONGGUANG ELECTRONICS CO LTD STATE OWNED NO 873 FACTORY
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Problems solved by technology
[0002] Due to the large amount of TVS tubes used in the circuit, ranging from a few to dozens or even hundreds, such a large amount will inevitably occupy a large amount of space on the circuit board, which is not conducive to the integration and miniaturization of products.
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[0016] The technical solution of the present invention is further described below, but the scope of protection is not limited to the description.
[0017] Such as figure 1 , figure 2 A kind of ceramic patch package bidirectional low-junction capacitance TVS diode shown, comprises bidirectional TVS tube core; One connection terminal of described bidirectional TVS tube core is connected with two-way parallel branch, and two-way branch is connected with low junction Capacitor dies, and the direction of the low-junction capacitor dies on the two branches is opposite.
[0018] On the two branches, the number of low-junction capacitance dies is the same.
[0019] The directions of the low-junction capacitance dies on any one of the two branches are in the same direction.
[0020] The bi-directional TVS die and the low-junction capacitor die are packaged in metal-ceramic patches.
[0021] On the two branches, the electrical parameters of the low-junction capacitance die are the ...
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The invention provides a ceramic chip packaging bidirectional low junction capacitance TVS diode. The diode includes a bidirectional TVS tube core, wherein one connection end of the bidirectional TVStube core is connected with two parallel branches, the two parallel branches are respectively connected with a low junction capacitance tube core, and directions of the low junction capacitance tube cores on the two branches are opposite. The diode is advantaged in that two sets of bidirectional low-capacitance TVS tubes are integrated by series, parallel and common pole modes, previously, the two-product space is needed, now only one-product space is needed, so a lot of installation space for line design is saved, and product integration and miniaturization are achieved.
Description
technical field [0001] The invention relates to a bidirectional low-junction capacitance TVS diode packaged by a ceramic chip. Background technique [0002] Due to the large amount of TVS tubes used in the circuit, ranging from a few to dozens or even hundreds, such a large amount will inevitably occupy a large amount of space on the circuit board, which is not conducive to the integration and miniaturization of products. Contents of the invention [0003] In order to solve the above-mentioned technical problems, the present invention provides a ceramic chip package bidirectional low junction capacitance TVS diode, the ceramic chip package bidirectional low junction capacitance TVS diode connects two groups of bidirectional low junction capacitance TVS diodes in series, in parallel and in common mode. The tubes are integrated together, which saves a lot of installation space for the circuit design, and realizes the integration and miniaturization of the product. [0004] ...
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IPC IPC(8): H01L25/07H01L29/861
CPCH01L25/072H01L29/861H01L2224/48137H01L2224/49111
Inventor 李大强石仙宏柯栋栋
Owner CHINA ZHENHUA GRP YONGGUANG ELECTRONICS CO LTD STATE OWNED NO 873 FACTORY