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A kind of led full plastic sealing structure and its plastic sealing process

A fully plastic packaging, LED chip technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of destroying the luminous effect, initial light leakage, etc., and achieve the effect of preventing leakage and reducing warpage

Active Publication Date: 2021-01-22
LINHAI DAWEI OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the substrate has multiple light-emitting surfaces, it is difficult for the phosphor adhesive layer formed by dispensing phosphor glue to completely cover all the light-emitting surfaces, and there will be different degrees of initial light leakage, which will destroy the overall luminous effect

Method used

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  • A kind of led full plastic sealing structure and its plastic sealing process
  • A kind of led full plastic sealing structure and its plastic sealing process
  • A kind of led full plastic sealing structure and its plastic sealing process

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Embodiment Construction

[0030] The object of the present invention is to provide an LED full-plastic sealing process and a full-plastic sealing structure for preventing initial light leakage and improving light output efficiency.

[0031] The LED full plastic package structure of the present invention can be found in Figure 8 , which includes a first fluorescent resin carrier 10 and a second fluorescent resin carrier 20, the first fluorescent resin carrier 10 and the second fluorescent resin carrier 20 have the same shape, the first fluorescent resin carrier 10 includes a first plane and a A first convex surface opposite to the first plane, the second fluorescent resin carrier 20 includes a second plane and a second convex surface opposite to the second plane, the curvature of the first convex surface and the second convex surface is the same as The radians of the first resin lens 16 and the second resin lens 26 are the same, so as to realize the uniformity of light emission from both sides. The ce...

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PUM

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Abstract

The invention provides an all-plastic package structure and plastic package process of an LED (Light Emitting Diode). The LED packaging of the same resin is realized by using the all-plastic package process, so that the warpage caused by the difference in thermal expansion coefficient can be reduced. In addition, wide-angle emergence can be realized because both sides of the LED are provided witha lens. The leakage of initial light can be prevented by arranging the same resin material at both sides.

Description

technical field [0001] The invention relates to the field of LED packaging, belongs to the classification number H01L33 / 00, and in particular relates to an LED full-plastic sealing structure and a plastic sealing process thereof. Background technique [0002] With the continuous improvement of light efficiency of LEDs (Light Emitting Diodes, light emitting diodes), in the field of general lighting, there is a trend of using LEDs to replace traditional light emitting devices. All-angle LED light source refers to an LED light source that can emit light from all angles. The full-angle LED light source has a broad market prospect due to its high luminous efficiency. [0003] The structure of the existing full-angle LED light source generally includes a transparent substrate and LED chips. The substrate is usually made of glass or sapphire. Parallel connection, and finally dot-coat phosphor glue on the upper and lower sides of the substrate to form two layers of phosphor glue l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/50H01L33/54H01L33/58H01L33/62
CPCH01L25/075H01L33/48H01L33/50H01L33/54H01L33/58H01L33/62H01L2933/0033H01L2933/0041H01L2933/005H01L2933/0058H01L2933/0066
Inventor 秦玲
Owner LINHAI DAWEI OPTOELECTRONICS TECH CO LTD