Foreign body repair method, device and storage medium
A technology for storage media and foreign objects, which is used in instruments, semiconductor/solid-state device testing/measurement, semiconductor devices, etc., can solve problems affecting product yield and other problems, and achieve the effect of reducing photoresist residue and coating residue phenomenon and reducing the impact.
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[0041] The technical solutions in the present application will be described in conjunction with the drawings in the present application embodiments. Obviously, the described embodiments are merely embodiments, not all of the embodiments. Based on the embodiments in the present application, those skilled in the art do not have all other embodiments obtained without making creative labor, which are the scope of the present application.
[0042] See figure 1 , figure 1 A flow chart of foreign matter repairing methods provided in the embodiment of the present application. like figure 1 As shown, the foreign matter repair method provided by the present application includes the following steps: 101, a photoresist layer is formed on the substrate, and the photoresist layer is partially divided to obtain a plurality of pending regions; 103 The height of each of the above-to-be tested areas is obtained, and the height of the foreign matter region is adjusted by comparing the foreign matter...
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