Quartz crystal wafer grinding device

Abstract

The invention discloses a quartz crystal wafer grinding device which comprises a base. A servo motor is fixedly connected to one end of the top of the base through a vertical rod, a supporting rod ismovably connected to the side, close to the vertical rod, of the top of the base through a hydraulic cylinder, a mounting plate is in threaded connection to the front end of the supporting rod througha second bolt, an articulated shaft is connected to one side of the top of the mounting plate through a first telescopic rod, a carrying plate is connected to the top of the articulated shaft, a fixed ring is arranged on the surface of the carrying plate, the fixed ring comprises an upper arc-shaped ring and a lower arc-shaped ring, the upper arc-shaped ring stretches into the lower arc-shaped ring, two ends of telescopic springs arranged in the upper arc-shaped ring and the lower arc-shaped ring are connected, a second telescopic rod is fixedly connected to the other side of the top of the mounting plate, and the top end of the second telescopic rod is in clamping connection to one end of the carrying plate. By arranging the carrying plate, the second telescopic rod, the upper arc-shapedring, the lower arc-shaped ring and the telescopic spring structures, the quartz crystal wafer grinding device has the advantages of grinding a quartz crystal wafer from multiple faces and facilitating fixation.

Description

technical field [0001] The invention relates to the technical field of quartz wafers, in particular to a quartz wafer grinding device. Background technique [0002] Quartz crystal has a piezoelectric effect, and it will produce mechanical vibration when it is subjected to an external alternating electric field. When the frequency of the alternating electric field is the same as the natural frequency of the quartz crystal, the vibration becomes very strong, which is the core of the quartz crystal oscillator. Components; when the quartz crystal is in use, it needs to be ground to obtain a high-quality quartz wafer. [0003] But there is following deficiency in prior art: [0004] 1. The existing grinding device cannot grind the quartz wafer from multiple angles; [0005] 2. It is inconvenient to fix the structure of the quartz wafer. Contents of the invention [0006] (1) Solved technical problems [0007] Aiming at the deficiencies of the prior art, the present inventio...

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Problems solved by technology

[0007] Aiming at the deficiencies of the prior art, the present invention provides a quartz wafer grinding device, which solves the problems in the prior art that the quartz wafer cannot be ground at multiple angles and the structure of the quartz wafer is inconveniently fixed

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