Thermoelectric semiconductor refrigeration and heating device facilitating shape adjustment

Abstract

The invention relates to a thermoelectric semiconductor refrigeration and heating device facilitating shape adjustment. According to the technical scheme, the thermoelectric semiconductor refrigeration and heating device facilitating shape adjustment comprises a plurality of temperature regulating units; each temperature regulating unit comprises a circuit board, each circuit board is provided with an N-type semiconductor and a P-type semiconductor which are connected, a flexible connecting conductor is connected between each N-type semiconductor A and the corresponding P-type semiconductor, the other end of each N-type semiconductor or the corresponding P-type semiconductor is connected with the corresponding flexible working conductor, each flexible working conductor is in a thin sheet shape or a harness shape, and the other end of each flexible working conductor is connected with a P-type semiconductor or an N-type semiconductor of another temperature regulating unit. By means of the thermoelectric semiconductor refrigeration and heating device facilitating shape adjustment, the shape can be adjusted according to the using requirement, and the flexible working conductors can bestretched out or drawn back within a certain scope.

Description

technical field [0001] The invention belongs to the technical field of semiconductor refrigeration and heating devices, and in particular relates to a thermoelectric semiconductor refrigeration and heating device that can be easily adjusted in shape. Background technique [0002] The traditional semiconductor technology that has been around for nearly half a century is mostly characterized by ceramic packages with a sheet-like appearance structure. Install thermoelectric semiconductor grains between two ceramic plates in a sandwich form, and cool or heat them after being energized. The defects of the existing semiconductor refrigeration device are as follows: 1. The surface is hard and cannot be installed flexibly. 2. It is necessary to contact the temperature control target through the hot and cold surfaces, so as to achieve the expected effect and be used in various occasions. 3. Due to the thermal stress of the ceramic sheet, the single-chip product can only be 100 squa...

AI Technical Summary

Problems solved by technology

The defects of existing semiconductor refrigeration devices are: 1. The surface is hard and cannot be installed flexibly

2. It is necessary to contact the temperature control target through the hot and cold surfaces, so that the expected effect can be achieved and applied to various occasions

3. Due to the thermal stress of the ceramic sheet, a single-chip product can only be 100 square millimeters at most, and most of the products on the market are within 60 square millimeters

[0004] However, the above-mentioned device installs semiconductor crystal grains and wires through a whole board core, its structure and shape are limited, and the overall shape of the device cannot be freely adjusted according to needs

When using the whole board core as a solution, it is difficult to accurately install the semiconductor crystal grains and wires on the board core, the processing procedure of the board core is complicated, and the production is more difficult. Once the board core is finished, its shape cannot be changed.

The wire cannot be stretched arbitrarily, and the contact surface with the outside world is small, so it is difficult to cool or heat the outside objects quickly

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