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Conductive cup processing technology

A processing technology, the technology of circular plate, applied in the field of conductive cup processing technology, can solve the problems of long production cycle, low work efficiency, high production cost, etc., to prolong the service life, reduce friction, ensure surface quality and dimensional accuracy Effect

Inactive Publication Date: 2019-11-12
重庆市鸿全电器制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, in production, multiple processes such as forging, stretching, stamping, and shaping are used, and it is found that there are a series of problems such as long production cycle, high energy consumption in each process, low work efficiency, and high production cost.

Method used

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  • Conductive cup processing technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Embodiment one: see Figure 2-4 , a kind of processing technology of conductive cup, it comprises the following steps:

[0038] S10, preparing a circular plate 1 of equal thickness, and the outer diameter of the circular plate 1 is equal to the outer diameter of the flange cover part N-1 of the conductive cup N;

[0039] S20, oiling the two board surfaces of the circular plate 1;

[0040] S30, the circular plate 1 is punched and formed by the stamping die M at one time.

[0041] Using the above-mentioned process method, since the equal-thickness circular plate 1 is prepared first, and the outer diameter of the circular plate 1 is equal to the outer diameter of the flange cover part N-1 of the conductive cup N, the non-stamping part of the outer edge of the circular plate 1 is formed as a conductive The flange cover part N-1 of the cup N does not need to be stretched, and at the same time, the accuracy of the outer dimension and the flatness of the shape of the flange ...

Embodiment 2

[0050] Embodiment two: see Figure 5-7 , a kind of processing technology of conductive cup, it comprises the following steps:

[0051] S10, preparing a circular plate 1 of equal thickness, and the outer diameter of the circular plate 1 is equal to the outer diameter of the flange cover part N-1 of the conductive cup N;

[0052] S20, oiling the two board surfaces of the circular plate 1;

[0053] S30, the circular plate 1 is punched and formed by the stamping die M at one time.

[0054] In this embodiment, the oil is mixed with one or more of paraffin oil, white mineral oil or rapeseed oil.

[0055] Specifically, the circular plate 1 is made of aluminum or iron.

[0056] In this embodiment, the preparation of the equal-thickness circular plate 1 is obtained by plate punching or plate wire cutting. Preferably, it is obtained by punching a plate, which can improve work efficiency.

[0057] Wherein, the stamping die M includes a die M-1 and a punch M-2, and when the punch M-2 i...

Embodiment 3

[0063] Embodiment three: see Figure 8-11 , this embodiment is basically the same as Embodiment 1 and Embodiment 2, the difference lies in that the outer top mechanism 2 of the flange cover part is also provided;

[0064] The flange cover outer ejection mechanism 2 includes a cylinder 2-1, a horizontal push rod 2-2, a vertical push rod 2-3 and a return spring 2-4.

[0065] The bottom end surface of the forming hole section M-101 of the inner flange cover of the die M-1 or the bottom end surface of the upper round hole section M-111 is provided with a push rod matching hole 2-5;

[0066] The middle part of the vertical ejector rod 2-3 is provided with a ring stopper 2-31;

[0067] The ejector rod matching hole 2-5 includes an upper hole section 2-51 and a lower hole section 2-52, and the inner diameter of the upper hole section 2-51 is smaller than the outer diameter of the ring stopper 2-31;

[0068] The upper part of the vertical push rod 2-3 is in clearance fit with the up...

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Abstract

The invention discloses a conductive cup processing technology which is characterized by comprising the following steps of S10, preparing a circular plate (1) with the uniform thickness, wherein the outer diameter of the circular plate (1) is equal to the outer diameter of a flange cover part (N-1) of a conductive cup (N); S20, coating oil on two plates surfaces of the circular plate (1); and S30,punch-forming the circular plate (1) through a punching die (M) at one time. The technology provided by the invention is simple and convenient to operate, one-time in-place punch-forming can be realized, the technology steps can be reduced, and the production efficiency is improved.

Description

technical field [0001] The invention belongs to a processing technology of a conductive cup. Background technique [0002] see figure 1 , which is a conductive cup, the conductive cup (N) has a flange cover part (N-1) and a cone part (N-2) integrally connected up and down. [0003] However, currently in production, multiple processes such as forging, stretching, stamping, and shaping are used, and it is found that there are a series of problems such as long production cycle, high energy consumption in each process, low work efficiency, and high production cost. Therefore, the process needs to be improved. Contents of the invention [0004] In order to solve one or more of the above-mentioned defects in the prior art, the present invention provides a process for processing a conductive cup. [0005] In order to achieve the above object, the present invention provides a processing technology of a conductive cup, which is characterized in that it comprises the following st...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D22/06B21D37/10B21D37/18B21D43/00
CPCB21D22/06B21D37/10B21D37/18B21D43/003
Inventor 周泉王隆方
Owner 重庆市鸿全电器制造有限公司
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