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Method and chip for manufacturing metal bumps

A technology of metal bumps and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., can solve problems such as waste of resources, and achieve the goal of saving resources, reducing risks, and reducing production complexity Effect

Active Publication Date: 2022-02-01
厦门通富微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] During production, different plating solutions need to be managed to avoid confusion and lead to production accidents. At the same time, one plating solution can only be used to produce metal bumps with one hardness, resulting in a large waste of resources.

Method used

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  • Method and chip for manufacturing metal bumps
  • Method and chip for manufacturing metal bumps
  • Method and chip for manufacturing metal bumps

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0028] refer to figure 1 , figure 1 It is a schematic flowchart of the first embodiment of the method for manufacturing metal bumps provided by the present application. The manufacturing method of metal bump that the application provides comprises:

[0029] S101: Perform at least a first electroplating treatment and a second electroplating treatment on the pad of the chip to form a laminated first electroplating layer and a second electroplating layer respec...

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Abstract

The present application discloses a method for manufacturing a metal bump and a chip, the method comprising: performing at least a first electroplating treatment and a second electroplating treatment on the pad of the chip to form a laminated first electroplating layer and a second electroplating layer respectively, and At least part of the parameters of the first electroplating treatment and the second electroplating treatment are different; performing annealing treatment on the chip. Through the above method, the present application can save resources, reduce risks, and reduce production complexity.

Description

technical field [0001] The present application relates to the field of packaging technology, in particular to a method for manufacturing metal bumps and chips. Background technique [0002] With the development of science and technology, liquid crystal panels have been widely used in people's daily life. When the driver chip of the LCD panel needs to be connected to the circuit, the metal bump is used as the connection point. [0003] At present, for COF (Chip on film, chip on film) and COG (Chip on glass, chip on glass) two packaging methods, the hardness of the metal bumps required is different. Therefore, during production, different plating solutions need to be prepared to achieve metal bumps with different hardness. [0004] During production, different plating solutions need to be managed to avoid confusion and lead to production accidents. At the same time, one plating solution can only be used to produce metal bumps with one hardness, resulting in a large waste of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L21/3205H01L21/321H01L21/67H01L23/488C25D5/02C25D5/10C25D5/50C25D7/12
CPCH01L21/4814H01L21/32051H01L21/321H01L21/67248H01L23/488C25D7/12C25D5/022C25D5/10C25D5/50H01L2224/11
Inventor 孙彬莫雷清
Owner 厦门通富微电子有限公司