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A power system with an inverter and its manufacturing method

A technology for power systems and inverters, applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve problems such as unfavorable reliability packaging, achieve the effects of preventing peeling, achieving stress balance, and preventing excessive stress

Inactive Publication Date: 2021-02-09
西藏华东水电设备成套有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the inverter chip (such as IGBT, MOSFET or other power components) is working, a large amount of heat will first cause the warping of the insulating substrate, so that the inverter chip and the soldering layer are peeled off, which is not conducive to the purpose of reliability packaging

Method used

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  • A power system with an inverter and its manufacturing method
  • A power system with an inverter and its manufacturing method

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Experimental program
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Embodiment Construction

[0025]The idea of ​​the present invention is to design a power system with an inverter to prevent warpage and chip damage. The basic idea is to form an annular through groove on the insulating substrate and fill the solder with an air gap structure to achieve the above functions. Examples will be described in the following.

[0026]Seefigure 1 with2, The power conversion circuit device of the present invention includes:

[0027]The heat dissipation substrate 21 is a metal plate, a ceramic plate, etc., the lower surface of which can be welded or riveted to a radiator. The radiator can be a fin-shaped radiator, a microporous radiator, an air-cooled radiator, etc. Preferably, the heat dissipation substrate 21 is a metal plate, and the material is copper.

[0028]The housing 28 is disposed on the heat dissipation substrate 21. The housing 28 is an injection molded housing and surrounds a built-in cavity, and the built-in cavity is used to seal the inverter chip.

[0029]Copper-clad substrate (DBC),...

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PUM

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Abstract

The invention provides a power system with an inverter and a manufacturing method thereof, which uses a plurality of annular grooves to divide the middle area of ​​a ceramic substrate into a plurality of isolated islands, so as to realize stress buffering, and can operate at high power and relatively high temperature. The reliability and stability of the power system can be ensured in a high environment; and, preferably, there is an air gap in the second depression, which can be used as a buffer compression part to further prevent excessive stress.

Description

Technical field[0001]The invention relates to the field of semiconductor device packaging, belongs to the H01L23 / 00 classification number, and specifically relates to a power system with an inverter and a manufacturing method thereof.Background technique[0002]The packaging of the existing power inverter chip mostly adopts the method of setting the conversion chip on the DBC substrate, and then soldering the DBC substrate to the heat dissipation substrate, which will not only cause the warpage of the DBC substrate, but also cause the warpage of the heat dissipation substrate. song. Generally, the existing power conversion package includes an insulating substrate with a conductive pattern. The insulating substrate includes an insulating layer, a first conductive pattern on the upper surface, and a second conductive pattern on the second surface. The inverter chip passes through the soldering layer. Welding on the first conductive pattern, and finally plasticizing the whole with resin....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/498H01L23/00H01L25/11H01L21/48H01L21/60H02M7/00
CPCH01L21/4846H01L21/4853H01L23/49811H01L23/49816H01L23/49844H01L23/562H01L24/81H01L25/115H01L25/50H01L2224/81345H01L2224/81365H02M7/003H01L2224/18
Inventor 郑晓杰张治国杨振洲
Owner 西藏华东水电设备成套有限公司