Memory bank utilizing temperature cycle principle

Abstract

The invention relates to the technical field of computers, and further discloses a memory bank utilizing the temperature cycle principle. The a memory bank is characterized in that buckles are arranged on the left side and the right side of the memory bank; a front circulating system and a rear circulating system are respectively arranged in the front box body and the rear box body; the bottom endof the front circulation system is fixedly connected with a return pipe, a cooling pipe and a liquid supply pipe; the front circulation system is movably connected with the rear circulation system through a connecting pipe; a support is fixedly connected between the outer sides of the front box body and the rear box body, a fan is connected in the support, the bottom end of the fan is fixedly connected with a rotating shaft, and the bottom end of the rotating shaft is fixedly connected with a water wheel. According to the memory bank utilizing the temperature circulation principle, the fan isdriven by the motor to move, the fan drives the rotating shaft to operate, and the effects of active heat dissipation and high heat dissipation power are achieved through the combined action of the water wheel, the liquid supply pipe, the return pipe, the front circulation system, the connecting pipe, the rear circulation system and the cooling pipe.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a memory stick utilizing the principle of temperature cycle. Background technique [0002] Memory sticks are an essential part of modern computers. In the history of computer development, there was a main memory on the motherboard of the computer, and the main memory was expanded through the memory sticks. With the progress and development of computer technology, the CPU of the computer will completely depend on the memory stick in the future. [0003] With the advent of the new era of memory sticks, the performance of memory has been greatly improved compared with the past. While the performance of a single memory is improved, the problems of power consumption and heat dissipation are still unavoidable. At present, the heat dissipation method commonly used in the market is to install aluminum heat sinks for heat dissipation. This heat dissipation method is passive heat dissip...

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a memory stick using the principle of temperature cycle, which has the advantages of active heat dissipation, high heat dissipation power, effectively avoiding dust absorption when the memory stick is working, convenient installation and plugging, etc., and solves the problem of passive heat dissipation. The efficiency is not high, the memory sticks work to generate static electricity to absorb dust, and it is inconvenient to install and unplug

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