Positioning, adhesive moving and tin planting jig applied to mobile phone maintenance

Abstract

The invention discloses a positioning, adhesive moving and tin planting jig applied to mobile phone maintenance, and relates to the field of mobile phone maintenance jigs. The jig comprises an upper-layer panel, a tin planting steel mesh upper layer, a middle-layer panel, a strong magnet, a tin planting steel mesh lower layer and positioning screws, wherein the upper-layer panel is provided with first screw holes and first positioning holes; and both the tin planting steel nesh upper layer and the tin planting steel mesh lower layer are provided with tin planting meshes and second positioningholes. According to the jig, a tin blockage device is arranged on a tin planting steel mesh, so that tin is effectively prevented from dropping, a mainboard of a mobile phone is prevented from being damaged when foreign matters on the mainboard of the mobile phone are cleared, and the mainboard of the mobile phone is effectively protected; through designing tin planting steel mesh positioning columns on the middle-layer panel, when the tin is planted by a maintenance staff, automatic alignment can be achieved by only needing to be aligned with the positioning columns, and manual alignment is not needed; after the tin is scraped by using the tin planting steel mesh, tin planting can be performed under high temperature environment without the mesh, the service life of the tin planting steelmesh is enhanced, and the scrap rate of the tin planting steel mesh is reduced.

Description

technical field [0001] The invention relates to the field of mobile phone maintenance jigs, in particular to a mobile phone maintenance positioning jig for removing glue and tin planting. Background technique [0002] At present, there are existing tin planting platforms for mobile phone maintenance in the market, such as figure 1 As shown, the main board of the mobile phone is placed in the positioning slot of the main board, and the tin planting is carried out through the tin planting net. Although the existing tin planting platform for mobile phone maintenance can meet the needs of maintenance personnel in the maintenance process, it has the following defects: First, The tin net needs to be aligned manually, and it is prone to offset during the tin planting process, resulting in the failure of alignment; second, when scraping the tin, the solder paste is easy to fall onto other parts of the mobile phone motherboard, and the cleaning process is cumbersome and easy to damag...

AI Technical Summary

Problems solved by technology

[0002] At present, there are existing tin planting platforms for mobile phone maintenance in the market, such as figure 1 As shown, the main board of the mobile phone is placed in the positioning slot of the main board, and the tin planting is carried out through the tin planting net. Although the existing tin planting platform for mobile phone maintenance can meet the needs of maintenance personnel in the maintenance process, it has the following defects: First, The tin net needs to be aligned manually, and it is prone to offset during the tin planting process, resulting in the failure of alignment; second, when scraping the tin, the solder paste is easy to fall onto other parts of the mobile phone motherboard, and the cleaning process is cumbersome and easy to damage the mobile phone Main board; thirdly, when planting tin, it is necessary to press the tin planting stencil, and use high temperature planting tin, resulting in bulging of the tin planting stencil, low reuse rate and short service life

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