Heat-conducting silica gel sheet and preparation method and application thereof
A thermally conductive silicone sheet, high thermal conductivity technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problem of low compression ratio of thermally conductive silicone sheets, reduce processing difficulty, and improve compression ratio Effect
Inactive Publication Date: 2019-11-29
成都天玙兴科技有限公司
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0005] The purpose of the present invention is to provide a heat-conducting silica gel sheet to solve the problem of small compression ratio of the existing heat-conducting silica gel sheet
Method used
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Experimental program
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Effect test
Embodiment 1
[0074] A heat-conducting silica gel sheet is prepared by the following method: a circular hole is punched out on the body of a heat-conducting silica gel sheet with a thickness of 30 mm and a thickness of 3 mm, and the radius of the circular hole is 12 mm.
Embodiment 2
[0076] A heat-conducting silica gel sheet is prepared by the following method: 2*2 round holes neatly arranged are punched out on a heat-conducting silica gel sheet body of 30*30mm and thickness of 3mm, and the radius of the round holes is 5.25mm.
Embodiment 3
[0078] A heat-conducting silica gel sheet, which is prepared by the following method: 3*3 round holes neatly arranged are punched out on a heat-conducting silica gel sheet body of 30*30mm and thickness of 3mm, and the radius of the round holes is 3mm.
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Abstract
The invention discloses a heat-conducting silica gel sheet and a preparation method and application thereof. N holes are arranged on the heat-conducting silica gel sheet body, and N is any natural number greater than or equal to 1. The holes are arranged on the heat-conducting silica gel sheet, and when the heat-conducting silica gel sheet is compressed, the compressed silica gel fills into the holes, i.e. the excess heat-conducting silica gel is discharged in time so that the compression ratio of the heat-conducting silica gel sheet is improved, and the heat-conducting silica gel sheet fullyexerts the heat-conducting function. A thicker heat-conducting silica gel sheet can be selected without reducing the heat conduction effect so that the heat-conducting silica gel sheet is ensured to have good heat conduction effect and good buffering effect and the processing difficulty can also be reduced.
Description
technical field [0001] The invention relates to the technical field of heat dissipation of electronic components, in particular to a heat-conducting silica gel sheet and its preparation method and application. Background technique [0002] With the development of science and technology, the requirements for electronic components are getting higher and higher, and they are getting closer to densification and miniaturization, which leads to a rapid increase in the heat generated by electronic components, and the increase in temperature will directly cause its own The performance and reliability of the battery are reduced, so heat dissipation becomes an important reason affecting its quality and life. [0003] Thermally conductive silicone sheet has the advantages of high elasticity and high thermal conductivity. Many manufacturers on the market use thermally conductive silica gel sheets as thermal interface materials to enhance the heat dissipation function of heating compone...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L23/367H01L23/373H01L23/467H01L21/48
CPCH01L21/4882H01L23/367H01L23/3737H01L23/467
Inventor 不公告发明人
Owner 成都天玙兴科技有限公司
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