Heat-conducting silica gel sheet and preparation method and application thereof

A thermally conductive silicone sheet, high thermal conductivity technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problem of low compression ratio of thermally conductive silicone sheets, reduce processing difficulty, and improve compression ratio Effect

Inactive Publication Date: 2019-11-29
成都天玙兴科技有限公司
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AI-Extracted Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a heat-conducting silica gel sheet t...
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Abstract

The invention discloses a heat-conducting silica gel sheet and a preparation method and application thereof. N holes are arranged on the heat-conducting silica gel sheet body, and N is any natural number greater than or equal to 1. The holes are arranged on the heat-conducting silica gel sheet, and when the heat-conducting silica gel sheet is compressed, the compressed silica gel fills into the holes, i.e. the excess heat-conducting silica gel is discharged in time so that the compression ratio of the heat-conducting silica gel sheet is improved, and the heat-conducting silica gel sheet fullyexerts the heat-conducting function. A thicker heat-conducting silica gel sheet can be selected without reducing the heat conduction effect so that the heat-conducting silica gel sheet is ensured to have good heat conduction effect and good buffering effect and the processing difficulty can also be reduced.

Application Domain

Technology Topic

Excess heatCompression ratio +3

Image

  • Heat-conducting silica gel sheet and preparation method and application thereof
  • Heat-conducting silica gel sheet and preparation method and application thereof
  • Heat-conducting silica gel sheet and preparation method and application thereof

Examples

  • Experimental program(10)
  • Comparison scheme(1)

Example Embodiment

[0073] Example 1:
[0074] A heat-conducting silica gel sheet is prepared by the following method: a circular hole is punched out on the body of a heat-conducting silica gel sheet with a thickness of 30 mm and a thickness of 3 mm, and the radius of the circular hole is 12 mm.

Example Embodiment

[0075] Example 2:
[0076] A heat-conducting silica gel sheet is prepared by the following method: 2*2 round holes neatly arranged are punched out on a heat-conducting silica gel sheet body of 30*30mm and thickness of 3mm, and the radius of the round holes is 5.25mm.

Example Embodiment

[0077] Example 3:
[0078] A heat-conducting silica gel sheet, which is prepared by the following method: 3*3 round holes neatly arranged are punched out on a heat-conducting silica gel sheet body of 30*30mm and thickness of 3mm, and the radius of the round holes is 3mm.
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PUM

PropertyMeasurementUnit
Thickness3.0mm
Radius12.0mm
Radius5.25mm
tensileMPa
Particle sizePa
strength10

Description & Claims & Application Information

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