Flash removing punch die and flash removing method for plastic package belt of chip tantalum capacitor

Abstract

The invention provides a flash removing punching die and a flash removing method for a plastic package belt of a chip tantalum capacitor. The flash removing punch die comprises an upper die plate, alower die plate and a base, the upper die plate and the lower die plate are mutually overlapped and fixedly connected together, a punch handle is fixedly connected to the upper die plate, a male die is fixedly connected to the lower die plate, a female die is fixedly connected to the base, a die hole is formed in the female die, and the male die can be sleeved in the die hole. The flash removing method comprises the following steps: providing power through stamping equipment, and blanking to remove flash of the plastic package belt of the chip tantalum capacitor. The technical scheme of the invention is adopted; the male die and the female die are driven to be sleeved with each other through power provided by the stamping equipment, the flash of the plastic package belt of the chip tantalum capacitor can be removed rapidly and cleanly, deformation of the plastic package belt is avoided, operation is easy and convenient, the labor cost is reduced, the labor intensity is relieved, the plastic package efficiency of the chip tantalum capacitor is improved, and the production quality is improved.

Description

technical field [0001] The invention relates to the technical field of tantalum capacitor packaging, in particular to a chip-type tantalum capacitor plastic package flash removal die and a flash removal method. Background technique [0002] Nowadays, all kinds of electronic equipment or devices are widely used in all aspects of people's daily life and work. These electronic equipment or devices need to use a large number of electronic components. Chip tantalum capacitors are a common type of electronic components. Tantalum capacitors are highly integrated and have small dimensions. Usually, multiple chip tantalum capacitors are plastic-packed on a strip. However, in the process of plastic-packing chip tantalum capacitors, the feed inlet is usually made of the gap in the strip. After the plastic seal is formed, the material inlet and exhaust outlet are left on the strip. It is difficult to remove and the removal is not clean, which affects the production quality of the later...

AI Technical Summary

Problems solved by technology

[0002] Nowadays, all kinds of electronic equipment or devices are widely used in all aspects of people's daily life and work. These electronic equipment or devices need to use a large number of electronic components. Chip tantalum capacitors are a common type of electronic components. Tantalum capacitors are highly integrated and have small dimensions. Usually, multiple chip tantalum capacitors are plastic-packed on a strip. However, in the process of plastic-packing chip tantalum capacitors, the feed inlet is usually made of the gap in the strip. material, resulting in plastic sealing, the strip retains the material inlet, exhaust outlet overflow

It is difficult to remove and the removal is not clean, which affects the production quality of the later process. In the prior art, manual operations are still used to remove the flashing of the chip tantalum capacitor plastic tape. The operator holds the chip with a tool such as a bamboo chip Type tantalum capacitors are plastic-sealed with flash scraping. This operation method is extremely inefficient and labor-intensive, and the flash cannot be completely removed.

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