High-precision laser cutting device

Abstract

The invention belongs to the technical field of laser cutting, and particularly relates to high-precision laser cutting device. The device comprises a laser emitting head main body and a focusing plate, wherein the laser emitting head main body is of a cylindrical structure; a guide support plate fixedly sleeves the bottom end of the laser emitting head main body; four guide rods are embedded at the side edges of the guide support plate; the bottom ends of the four guide rods are connected with the focusing plate; a focusing lens is fixedly embedded in an opening of the focusing plate; and thetop ends of the four guide rods are connected with an annular pressing plate. The device is provided with a distance measuring instrument for measuring the actual distance from the laser emitting head main body to a thin-plate-shaped workpiece; a focusing motor rotates according to the measured actual distance; the top end of an annular pressure plate is pressed by the outer circular surface of an eccentric wheel, and the focusing plate and the focusing lens are driven to regulate and control the focal length of a laser beam emitted by the laser emission head main body, so that the focal point of the laser beam emitted by the laser emitting head main body is always positioned on the surface of the thin-plate-shaped workpiece, and the accuracy of laser cutting is improved.

Description

technical field [0001] The invention relates to the technical field of laser cutting, in particular to a high-precision laser cutting device. Background technique [0002] Laser cutting is a relatively common and widely used method in laser processing. With the wide application of laser cutting in various fields, laser cutting is used in the cutting of various materials. The method of laser cutting is as follows. When the laser cuts the zero waste edge, because the equipment in the prior art has no negative pressure adsorption, it is easy to pull the material sheet, which will cause the material sheet to defocus during the cutting process, resulting in weakened laser energy and cutting. In view of this, there is an urgent need in the technical field for a laser cutting structure and equipment that effectively absorbs materials, effectively solves the phenomenon of laser energy weakening caused by cutting focal distance, and cuts materials continuously, and at the same time c...

AI Technical Summary

Problems solved by technology

[0007] Aiming at the deficiencies of the existing technology, the present invention provides a high-precision laser cutting equipment, which solves the problem that the current laser cutting structure device is prone to inaccurate focusing when encountering structures with uneven surfaces, and the use of vacuum suction force For thin-plate-shaped workpieces, it is easy to cause permanent deformation of thin-plate-shaped workpieces due to excessive suction force

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