Unlock instant, AI-driven research and patent intelligence for your innovation.

Laser diode surface mounting structure

A laser diode and mounting structure technology, applied to lasers, laser components, semiconductor lasers, etc., can solve problems such as thermal stress and asymmetry

Pending Publication Date: 2019-12-10
李 训福 +1
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With such a structure, the wiring of the heat conduction plate is completely on one side, which is asymmetrical, and thermal stress will inevitably occur

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Laser diode surface mounting structure
  • Laser diode surface mounting structure
  • Laser diode surface mounting structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0072] figure 2 ,Include figure 2 (a), figure 2 (b), figure 2 (c) and figure 2 (d), showing the surface mount structure diagram of the edge-firing laser diode according to the present invention, wherein, figure 2 (a) is the side view of the heat conducting plate; figure 2 (b) is a top view of the laser diode chip mounted on a metal plate without an insulating frame; figure 2 (c) for figure 2 (b) a general structural drawing of the structure shown including the insulating frame; and figure 2 (d) is a combined side view of the laser diode chip installed on the heat conduction plate, the first metal plate and the printed circuit board in sequence. Please also refer to figure 2 (a) figure 2 (b), figure 2 (c) and figure 2 (d), according to one of the laser diode surface mount structure 10 of the present invention, comprising:

[0073] At least one side-firing laser diode chip 20, including two electrodes 21 having an anode 211 and a cathode 212;

[0074] ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a laser diode surface mounting structure. The structure comprises at least one side-emitting laser diode wafer comprising two electrodes, a heat conducting plate which is provided with an upper conducting layer, a lower conducting layer and at least one conductor through hole penetrating through the upper conducting layer and the lower conducting layer and is used for bearing one of the two electrodes of the at least one side-emitting laser diode wafer, more than two metal plates which are arranged on a plane at intervals, and an insulating frame provided with an opening, wherein one first metal plate is arranged below the heat conducting plate and is in contact with the lower conducting layer of the heat conducting plate, the second metal plate is arranged adjacent to and separated from the first metal plate, and the insulating frame is arranged above the more than two metal plates and is used for fixedly holding the more than two metal plates.

Description

technical field [0001] The invention relates to a laser diode surface mounting structure, in particular to a surface mount technology (SMT) edge-firing laser diode packaging structure, which can meet the requirements of large current, high heat dissipation and no thermal stress. Background technique [0002] figure 1 ,Include figure 1 a and figure 1 b, shows the packaging structure of the existing edge-firing medium and high power (referring to output optical power greater than 50 mW) laser diodes, where figure 1 a is the laser diode wafer structure, figure 1 b is the existing laser diode package structure. refer to figure 1 a, The structure of the laser diode chip (laser chip) is based on the substrate (substrate, 100), and then atoms are piled up on the substrate by various deposition methods, called the epitaxial layer (epitaxial layer, 101). For red light and near-infrared light (0.7~1.1 um) laser diode chips, most of them are gallium arsenide (GaAs) crystals, and ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/024H01S5/022H01S5/0232
CPCH01S5/02469H01S5/022H01S5/0232H01S5/0683H01S5/02476H01S5/02216H01S5/4031H01S5/4018H01S5/0231H01S5/02345H01L2224/73265H01S5/0425H01S5/02208H01S5/02325
Inventor 李训福李後杰
Owner 李 训福